Products

High-performance phototool film enclosures are made from rugged, corrugated board. Package currently is used for delivery of Tecnilith Amber film. Eliminates styrofoam and cardboard spacers common in previous three-piece configurations. Films ship in a single package with no risk of shedding. Within the box, films are enclosed in a vacuum-sealed foil bag that opens easily and is re-closable. Films are supplied with three rounded corners and a square notch, an indicator of the emulsion side. Conventional fiberboard package stiffeners have been replaced with black plastic cleanroom-compatible ones.

Exopack Advanced Coatings, www.exopackadvancedcoatings.com

Presa RMK-30 immersion tin for PWG/ PKG produces thick deposit and mitigates tin whiskers.  Compatible with virtually all commercial solder masks; usable in vertical or horizontal equipment. Deposits via displacement on copper surface. Tin deposit said to maintain excellent solderability, even with higher temperatures and following long storage. Fluoride-free bath operates at relatively low temperatures; delivers consistent performance throughout long service life. Compatible with eutectic and Pb-free solder; meets requirements of press fit connections.

Uyemura Intl. Corp., www.uyemura.com
Riston PlateMaster PM300 dry film photoresist is a fine line copper/tin and copper/solder plating film. Is said to have excellent resolution and wide processing latitude.

DuPont Electronics and Communications, http://electronics.dupont.com
Idealine silver halide phototooling plotter film is for fine line and feature imaging. Is said to improve dimensional stability.

DuPont Electronics and Communications, http://electronics.dupont.com
Pyralux flexible laminate is for high-speed digital and high-frequency applications. Comes in a variety of thicknesses, with a Dk as low at 2.3 and a dissipation factor down to 0.002.

DuPont Electronics and Communications, http://electronics.dupont.com

CB500 removable conductive silver plating ink is a screen-printed ink for selective electroplating. Is for additive, low-temperature processing on rigid and flex boards. Reportedly eliminates need for bus bars or other copper plating connections; reduces chance of forming unintended copper antennae; removes need for after-plating.

DuPont Electronics and Communications, http://electronics.dupont.com

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