VA 7124 HP6 is for applying dry-film solder mask, copper foil, photoimageable cover layers and selective plating. Features stainless steel construction, suitable for clean rooms; dynamic and static slap down cycles; and multilingual operator interface. Lamination pressure is adjustable from 1 to 6 Kg/ cm² (14 to 85.3 PSI). Maximum lamination temp. is 180°C (356°F).

Automatic Lamination Techologies, www.dynachem.eu

NXP SimPort Design Center can create custom reference designs and immediately verify and test designs online using WebSIM technology. E-commerce tools allows component purchases immediately following design test and approval. Create a bill of materials from a simulated design and view real-time pricing and part availability.

Design Center combines engineering software, Internet and simulation technology to create a simulated design solution. Is customized to meet manufacturers' needs and features their products and technologies in an easy-to-use Web application. Mimics real-life design process.

Digi-Key
Transim Technology
NXP Semiconductors
http://web.transim.com/main/DesignCenter.aspx?bc=NXP&link=ManufacturerNXP

 

FloTherm software is for IC thermal characterization and design. Is a Web-based platform that automates design tasks associated with full-spectrum thermal characterization and validation. Is said to reduce time spent on thermal characterization and design by up to 25% by providing an automated process that includes pre-verified thermal models. Addresses full-spectrum thermal metric and compact model generation with adherence to JEDEC standards; package-aware parametric design for what-if analysis; EDA tool interfacing for detailed modeling of BGA substrates for physical layout, and data mining of simulation data.

Mentor Graphics, www.mentor.com 

 

40+Gb/s SFF-8470 4X passive copper cabling products support high-speed interconnect applications such as computing, enterprise networking and network storage systems. The low latency assemblies support data transfer rates from 2.5 to 10+ Gb/s per lane. Feature a shielded wafer construction where the signal conductors are directly attached to the connector's contacts. The twin-axial shielded conductors are laser-welded. Die cast back shells and latch are interoperable with all compliant interfaces. Supports InfiniBand  SDR, DDR and QDR; Ethernet 10GBaseCX4, 40GBaseCR4; FibreChannel; RapidIO; Myrinet; SAS; SATA; Aurora; VITA VXS and XAUI/XAUI-2 IO interface links, as well as SONET/SDH. Options include 24 to 30 wire gauges and various assembly lengths for specific applications.

Siemon, http://www.siemon.com/is/