Altium Vault 1.2 adds the ability to migrate data from one vault to another, and enhanced support for connecting to corporate enterprise systems, such as ERP and PLM. Can be hosted on an organization's own network infrastructure. Permits traceability and "where-used" Information through disciplined revisioning. Shortens design cycles through design reuse. Is said to reduce risk through smart supply chain intelligence during design time, not after where it is most costly. New Team Configuration Center (TC2) centralizes and standardizes design environment, from design tool setup and configuration to document templates and manufacturing file formats, which can be set up and automatically deployed to each engineer’s desktop.

Altium, www.altium.com

Cupracid AC conformal plating process permits high throwing power in BMV’s and through-holes at high current density. Provides a uniform surface distribution leading to a reduced plated copper thickness of about 3μm. Is a DC (direct current) process for high volume using vertical conveyorized line/plating and sparger electrolyte agitation. Permits conformal copper plating with soluble anodes in DC mode. All additives can be controlled using CVS (cyclic voltammetric stripping). May also be used with air agitation in hoist type equipment. In tests, a plating time of 60 min. and a current density of 3 A/dm², the throwing power of a 1.2mm thick panel with hole diameters of 0.3/0.25mm showed >95% min throwing power at 0.3mm and >90% min at 0.25mm.

Atotech, www.atotech.com