FlexVIA-Plus delivers single-stage plasma processing - including etchback and desmear -- of up to 30 panels (panel size 500 x 813mm/ 20 x 32") per cycle, enabling a rate of as much as 200 units per hour. For manufacturing flexible PCBs. Horizontal electrode design, with integrated rack, provides optimum material alignment. Versatile horizontal racks for processing of various flexible PCB sizes and make loading easy. Small footprint. Descum effectively removes resist residue from innerlayers and panels and residual solder mask bleed for better bonding and solderability. Features temperature-controlled electrodes for process repeatability.

Nordson March, www.nordsonmarch.com

DDI laser direct imager features laser diodes that last more than 30,000 hr. Multilaser-concept continues production even when lasers break down. Has compact construction and small footprint. Granite base, with high-precision axes and dynamic linear motion. Automatic online-scaling of data by CCD cameras for optimum fitting. High depth of focus by optical concept with variable focus length (300µm). Images structures up to 50µm lines/spaces.

DDI-DT model includes a precision double-table construction for precise, fast table change. Runs simultaneous loading, registration and imaging. 

Schmoll, schmoll-maschinen.de

Megtron7 multilayer board laminate has a dielectric constant (Dk) of 3.3 and dissipation factor (Df) of 0.001@1GHz. Features high heat resistance. Is compatible with lead-free soldering.

Panasonic, http://www3.panasonic.biz/em/e/product/megtron_7/

Model 5335xi and Flex5335 UV laser drills  use the same beam positioning technology as the 5330 Series. Have solid-state, real-time power control. New software and operating systems enhance tool usability, process logging and development functionality. Replace 5330xi and Flex5330.

ESI, www.esi.com