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OM Group Releases Via Dep 4550 Electroless Copper

Published: 17 December 2014

Via Dep 4550 electroless copper reportedly provides blister-free electroless copper deposits on polyimide, flexible printed circuit boards, Kapton, Teflon, plated-over-filled vias, and high Tg epoxy laminates. Has nearly zero internal stress and excellent adhesion. Passes thermal cycling test (IPC-TM-650, 2.6.26A) and thermal stress (IPC-TM-650, 2.6.8E) requirements. Is designed as a drop-in replacement process for vertical and horizontal applications. The chelation system is tartrate-based and has no cyanide or heavy metals.

OM Group, www.omgi.com/

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