Gold-Tin Plating deposits can be selectively applied for interconnecting RF and microwave components, lead frames and other miniature parts on high-frequency PCBs.

Proven process has been used on ceramic substrates, metals and metal alloys such (Kovar or copper tungsten). Can be applied to ceramic loaded organic boards such as Rogers RO3000 that can withstand processing temperatures in excess of  300oC. For selectively plating multiple-image panels on one or both sides prior to etching. 

Remtec, www.remtec.com

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