RP800+XT Series photoplotters have a unique design for a large exposure area.

Read more: First EIE Rolls Out RP800+XT Series Photoplotters

PallaBond direct palladium surface finish process, with optional gold layer, permits direct deposition of palladium on copper, without using nickel. Is suitable for key press, high-frequency, flexible PCB gold, aluminum and copper wire-bonding applications. Is said to provide superior solder joint strength for lead-free and eutectic SnPb solder and is compatible with many new base materials and soldermask types. Operates at a thickness of less than 300nm, for fine lines and spaces. Is free of thiourea, lead and nickel.

Atotech, www.atotech.com

ImageFlex ink for flexible printed circuits manufacturing is said to offer improved flexibility and have excellent adhesion properties for all commonly used substrates. is halogen free. Has a good color range and can be applied by screen print or spray coating methods.

Sun Chemical, www.sunchemical.com

 

Duraposit SMT-810 electroless nickel solderable final finish is said to have longer bath life and improved deposit uniformity. For use with Aurolectroless SMT 520 immersion gold. Features corrosion resistance and solderability which is maintained at both high and low bath loading and throughout the solution life. Self-adjusting pH simplifies bath operation. Fine Ni grain deposits around annular ring and pad corner, for gold adhesion and to reduce gold peel-off. Lower Ni content make-up at Ni 5g/L can reduce waste water discharge.

Dow Electronic Materials, http://www.dowelectronicmaterials.com/products/printed_circuit_boards/hdi/duraposit-smt_810.htm