AgCite conductive silver inks sinter at low temperatures and are suited to a range of substrate surfaces, including paper, polymers, glass and a range of coatings. Apply using inkjet printing. Custom formulations available for specific printing processes and applications. For a variety of printed electronics applications, including RFID, OLED lighting, circuits, and others requiring high conductivity. Ideal for low-volume applications.
Pads printed circuit board design software is now upgraded to include 3D tool capabilities plus usability enhancements. The new technology provides visualization, placement, and design rule checking in 3D, minimizing iterations with mechanical and manufacturing teams. Schematic design and layout enhancements improve usability across the flow for increased user productivity.
Enables full 3D visualization, placement, design rule checking and PDF creation. Commercial engine provides faster, more robust performance compared to traditional open-source software, in support of large databases. Import STEP (Standard for The Exchange of Product Data) models and exports full PCB assemblies in multiple formats. Extends 3D functionality in Pads Professional with optional four million parts 3D library and ECAD-MCAD collaboration tool. 3D capabilities scalable depending on product configuration.
Layout updated to include enhanced reference designator placement with physical design reuse elements, improved padstack editing, and updated translator and migration tools. The PADS schematic capture feature now includes the ability to automatically renumber a schematic sheet and update the bill of materials (BoM) report. Includes access to PartQuest component portal which includes schematic symbols, footprints, and parametric data for over 450,000 parts. Translators from competitive tools updated, including import of Altium V15 libraries and designs.
Ultraspeed Trio drilling and milling systems is three stations in one machine. Newer drilling unit increases frequency approximately 33% to 1,200 strokes/min. Tolerance in precision was reduced down to +15μm. Each station has two different spindles. Division of spindle types among drilling heads can be chosen: twice drilling (micro-drilling of <0.1mm and holes up to 6.35mm), two times milling (for FR-4 and IMS) or a combination with drilling and milling. A new interchangeable pressure foot for drilling and milling is on the same spindle. Can switch from drilling insert to milling blank insert. A drilling-milling spindle works in the revolutions range of 10,000 to 140,000 turns per min. Each station has its own spindle axis and table axis. Spindle and z-drive are placed on top of each other.
ME series in-mold electronic inks are designed to help reduce the need for rigid printed circuit boards. Are designed to withstand manufacturing processes such as thermoforming and injection molding. Have a single connection point and no wires behind console.
HSIO validation assistant is a data mining tool for ScanWorks. Automatically analyzes database of signal integrity test data and quantifies risk associated with potential design flaws or poorly performing devices on a system’s high-speed input/output (HSIO) buses. Organizes and correlates validation database to identify vulnerabilities. Redundant validation testing can be identified and eliminated. ScanWorks HVA has been integrated into ScanWorks HSIO; validates signal integrity on high-speed buses on Intel circuit board designs.
IPC-A-600 PCB Process Sequence Kit is an aid for teaching the IPC-A-600 Acceptability of Printed Boards Training and Certification Program. Contains boards that represent steps in the PCB fabrication process, documentation describing the process steps, and care and handling instructions.
