New Products

NI AWR Design Environment v. 12.01 offers new amplifier-, antenna- and radar-specific features, as well as ease-of-use improvements, speed enhancements and additional third-party integration flows. Includes additions to load-pull capabilities and improvements to system simulation within Visual System Simulator software, layout, tuning, yield analysis and optimization capabilities.

National Instruments, www.awrcorp.com/v12


Parts Concierge virtual assistant allows hardware engineers to request any part be built and added to their design on their behalf. Parts are created by Upverter component engineers, in real-time. Upon adding a part to a design, the part will be built in real-time. Frees engineers from creating and verifying schematic symbols and footprints for any electronic component. All requested parts are verified for accuracy and join a parts library accessible to all users.

Upverter, upverter.com

Microwave Impedance Calculator now includes additional dielectric materials, thermal model capabilities, and bug fixes. Software is intended to assist with microwave circuit design in predicting the impedance of a circuit made with high-frequency circuit materials. Has capability to predict transmission line losses. Determines predicted impedance and other electrical information.  Uses closed form equations to determine impedance and loss. Loss calculation is divided into conductor loss and dielectric loss. Also predicts wavelength, skin depth and thermal rise above ambient.

Rogers Corp., www.rogerscorp.com

Three Wavelength series Ledia direct imaging (DI) systems are for high-speed exposure of solder mask and innerlayer and outer-layer resists. These five and six exposure head systems combine 365, 385 and 405nm wavelength LED emissions. Reportedly deliver 15µm lines and spaces with well-defined edges, with improvements in throughput.

Ucamco, www.ucamco.com

 

PE827 and PE828 electronic inks cure at as low as 60°C. Potential applications include printed antennas, sensor applications, heated surfaces and smart packaging applications. Viable substrate options for printed electronics include PVC, polystyrene, high-density polyethylene, and acrylic polymers.

DuPont, www.dupont.com

 

VisualCAM Stencils v. 16.7 design tool streamlines and automates stencil/paste designs generation. New release defines paste shapes using pitch rules. Features enhanced library management, improved identification and shape assignments, and improved paste generation and reporting. Includes many new macro commands and a powerful macro developer to aid in automation, data preparation and stencil generation.

Wise Software Solutions, wssi.com

Register now for PCB West, the Silicon Valley's largest trade show for printed circuit board design, fabrication and assembly: Sept. 15-17 at the Santa Clara Convention Center pcbwest.com

Page 188 of 406