Valor Process Preparation software consolidates a full product model and any number of related manufacturing process definitions into a single efficient container. Applies advanced process simulation and automated machine library generation techniques to create complete "ready to go" machine programs, operational data and work instructions for processes such as SMT, assembly, test & inspection, and stencil creation. Includes enhanced support for rapid test programming, including the ability to intelligently link schematic, PCB layout and Bill of Materials (BoM) data. Selecting a track on the PCB layout immediately shows the node in the corresponding schematic diagram from design, and vice versa. Helps ensure testability and rapid debug time when investigating test failures at shop-floor repair stations. Provides a simple way to directly compare electrical component data between schematic and production BoM, ensuring correct output for test and SMT machines. Is said to minimize changeover downtime and startup risk when executing manufacturing changes.
Elpemer AS 2467 SM-DG solder resist has direct imaging capability and high-temperature resistance. Has short exposure times and high resolution. Withstands thermal shock tests of more than 1000 cycles at -40°/+175°C without cracking or loss of adhesion; is suitable for exposure to permanent temp. loads >1000h up to 175°C. Can be used with Apollon 11 DI, Ledia, MDI exposure unit, Nuvogo 800, and UV-P300 direct imaging systems.
POD Builder has access to one million manufacturer part numbers on demand. Is said to output 3D STEP models and footprints to 21 different CAD formats. Customizable for working units, drafting line widths, pad shapes, footprint rotation, unlimited pin 1 polarity markings, design rules, solder joint goals and customize 3D STEP color assignments. Merges component dimensions and personal preferences to auto-generate unique, consistent footprints and 3D STEP models. New part requests available and delivered in a neutral format.
ACE 3000 3D translator converts between 3D and EDA formats STEP, IGES, ACIS, STL, DXF, GDSII, Gerber, ODB++, postscript and PDF files. Imports directly to 3D modeling environment. Intelligently organizes geometries and layers as individual assemblies for easy editing. Enables constructing of entire designs and layout assemblies in the user-preferred 3D environment. Generates required manufacturing formats including Gerber, GDSII, ODB++, NC, and more. Outputted files are tested and fully compatible with SolidWorks, Autodesk Inventor, PTC Creo, Rhino 3D, SketchUp 3D and others. Includes full-featured and powerful editor, with features such as clip regions, generate anti-areas (i.e., negative polarity), perform Boolean operations, fill complex polygons, and data optimization.
InfinityLine combines and optimizes CombiLine and PremiumLine. Measured values can be digitally recalled via a user tablet or via internet browser. Optimized module lengths and the use of intermediate plates reportedly result in a reduction of chemical drag-out. Meets current energy-efficiency standards, such as IE3 and IE4. Includes new etching options.
Series 5002 Silver Zebra connector is for LCD to printed circuit board connections. For board-to-board connections where space is limited. Current carrying capacity up to 300 mA per square 0.040". Contact resistance of less than 500 mΩ. Creates redundant electrical contact through a unique product design that incorporates 240 alternating layers of silver-filled conductive elastomer and nonconductive silicone material per inch of connector. Provides a centerline pitch between layers of 0.004" (0.10mm) and permits 0.015" (0.381mm) pad spacing on the PCB.
