LUXEMBOURG – Chinese copper-foil manufacturer Jiujiang Defu Technology has terminated its planned acquisition of Circuit Foil Luxembourg after the Luxembourg Ministry of the Economy imposed conditions that would have prevented Defu from gaining operational control of the business.

TOKYO - Toppan has constructed a new manufacturing line at its Niigata plant for flip chip-ball grid array (FC-BGA) substrates.

FREUDENSTADT, GERMANY - Driven by AI server board and high-performance computing momentum, Schmid Group reported preliminary bookings of about 95 million euros for 2025,

AUSTIN, TX – TechSearch International’s newest Advanced Packaging Update finds that rapid growth in AI servers and data center hardware will push substrate demand beyond available capacity by 2028, forcing manufacturers to expand production within the next three years. The report highlights rising pressure on substrate materials – especially glass fiber used in core constructions – and evaluates potential alternatives as supply tightens.