TOKYO - Toppan has constructed a new manufacturing line at its Niigata plant for flip chip-ball grid array (FC-BGA) substrates.

FREUDENSTADT, GERMANY - Driven by AI server board and high-performance computing momentum, Schmid Group reported preliminary bookings of about 95 million euros for 2025,

AUSTIN, TX – TechSearch International’s newest Advanced Packaging Update finds that rapid growth in AI servers and data center hardware will push substrate demand beyond available capacity by 2028, forcing manufacturers to expand production within the next three years. The report highlights rising pressure on substrate materials – especially glass fiber used in core constructions – and evaluates potential alternatives as supply tightens.

AIKEN COUNTY, SC – AGY will invest $12.1 million to expand specialty glass fiber production at its Aiken County facility, adding 80 jobs and increasing US capacity for materials used in semiconductor packaging and high-performance printed circuit boards. Operations are expected to begin in early 2026.