KIRCHHEIMBOLANDEN, GERMANY – Ventec Central Europe GmbH has consolidated its two manufacturing plants in Kirchheimbolanden into a single, modernized facility spanning more than 13,500 m². The upgraded site is designed to streamline production, improve delivery performance, and enhance material availability for customers across Europe.

TOKYO, JAPAN – Panasonic Industry, part of the Panasonic Group, has announced an expansion of its MEGTRON multi-layer circuit board material production. The company plans to double output over the next five years to address surging demand from AI servers and ICT infrastructure.

WASHINGTON – SEMI announced that global semiconductor equipment billings reached $33.07 billion in the second quarter, representing a 24% year-over-year increase and a 3% quarter-over-quarter gain. The strong results were driven by demand for advanced logic and high-bandwidth memory (HBM) DRAM applications, alongside increased shipments to Asia.

INDIA – The Andhra Pradesh government has cleared an ₹856-crore incentive package to support the development of India’s largest printed circuit board (PCB) facility, to be established by Syrma SGS in partnership with Korea’s Shinhyup Electronics.