ARAYA, THAILAND – Doosan is investing approximately $135 million to establish a new production base for copper clad laminates (CCL), a key material used in printed circuit boards, as global AI infrastructure demand accelerates.

FREUDENSTADT, GERMANY – Schmid has introduced its Any Layer Embedded Trace (ET) process, a panel-level manufacturing platform designed to support next-generation advanced packaging as AI and high-performance computing drive increasing substrate complexity.

SAN JOSE, CA – Cadence reported first-quarter revenue of $1.4 billion, up from $1.2 billion year over year, driven by strong demand for AI-driven design tools and semiconductor solutions. 

Ventec International Group is evaluating the potential establishment of a new manufacturing facility in the United States as part of its strategy to expand its global footprint and better serve North American customers.