FREUDENSTADT, GERMANY – Schmid Group reported more than $30 million in new orders since mid-May, driven by demand for advanced PCB and substrate manufacturing equipment used in AI infrastructure, high-speed networking and optical communication applications.

The orders were secured from customers in China, Taiwan, South Korea and Europe and include the company's InfinityLine production equipment for high-density interconnect multilayer (HDI-ML) and modified semi-additive processing (mSAP) applications. The equipment is targeted at manufacturing advanced interconnects used in AI servers, optical modules, high-performance computing and next-generation data infrastructure.

Schmid said the recent bookings indicate customers are moving from technology evaluation and qualification into capacity expansion investments. Total order intake for the company reached approximately $49.7 million from Jan. 1 through June 15.

The company expects continued momentum in HDI-ML and mSAP markets as demand grows for higher layer counts, tighter design rules and increased routing density to support AI and networking applications.

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