ONTARIO, CANADA - ITL Circuitshas announced that it will install a Chemcut 8000 Strip-Etch-Strip system in its facility in Markham, Ontario.
ITL Circuits claims a thirty-year history of using Chemcut equipment, citing the company equipment's reliability, low-maintenance, and moderate price structure.
“We are very pleased that ITL Circuits has selected Chemcut to be the
provider of chemical etching and cleaning process equipment at their
new state-of-the-art facility,” stated Rick Lies, Chemcut’s CEO.
ITL Circuits, founded in 1970, is a PCB manufacturer, producing
single-sided to multi-layer PCBs for commercial, military,
telecommunications, medical, industrial, and aerospace applications.
Chemcut Corporation, founded in 1957, produces spray chemical etching equipment for volume and prototype production.
LAS VEGAS, - Nordson Corporation will be represented by a wide array of products on display at the IPC Printed Circuits Expo, APEX and the Designers Summit,
April 1-3, 2008 in Las Vegas, the international technical conference
for printed circuit boards, design, electronics manufacturing, and test.
Nordson will be highlighting its products through subsidiary companies
Asymtek (Booth 511), Dage Precision Industries (Booth 1632), EFD (Booth
1470) March Plasma Systems (Booth 1229) and YESTech (Booth 559), all
parts of its Advanced Technology Systems business segment.
“The APEX/IPC show provides us with an opportunity to demonstrate the
full range of Nordson solutions, which are specifically designed to
help our customers work more proficiently and improve their bottom
line," said Andy Dunn, Nordson Senior VP.
TAIWAN - Compact designs coupled with increasing functionality
in the handset industry is driving a trend towards more layers in
high-density interconnect (HDI) boards. Two upcoming high-end handsets
will reportedly use a four-layer stack-in structure, according to
industry sources.
Layer density has increased from single- and double-layer boards, and
an increasing percentage of high-end handset products require
three-layer HDI boards. Companies such as Unitech Printed Circuit
Board have seen three-layer HDI boards reach 20% of sales,
according to GM Cheng-Hung Hsu. While these boards are already common
in the industry, two high-end handset vendors have started
manufacturing four-layer HDI boards, with shipments scheduled for
September.
The four-layer boards reportedly sell for a 50% higher price over
three-layer, a significant profit for those who produce them, but Hsu
points out that the current produced three-layer boards are already
capable of meeting design requirements for high-end handsets. Given the
typical design trends towards smaller size and greater functionality
however, it is likely that more manufacturers will follow the lead.
With the move toward higher layer board configurations, Hsu also
speculated about a possible shortage of HDI boards used for handsets,
given the economic slowdown keeping manufacturers conservative on
expansion.