CANBY, OR – In the assembly world, putting vias directly in surface mount pads is often not recommended. But for routing large or fine-pitch BGAs, bypass capacitors, thermal management, and grounding on high-frequency parts, via-in-pad can be an effective, if demanding, solution.
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PITTSBURGH — ZTE Corp., China's largest publicy held telecommunications equipment OEM, has signed a deal to use Ansoft Corp.'s signal and power integrity analysis software for printed circuit boards.

The new design methodology permits ZTE to eliminate expensive build-test-repeat iterations in its design cycle, the company said in a statement.

"Our engineers are very experienced in PCB design and needed to expand capabilities for EMI/EMC. Previously, we were using expensive and time-consuming prototyping and testing to make sure the design performance met requirements," said Zhu Shunlin, chief engineer of the EDA group at ZTE. "Ansoft's design methodology and technical support team helped us solve this issue, improve product performance, reduce cost and speed our time to market."