MARLBOROUGH, MA – Flomerics’ MicReD subsidiary will play a major roll in the recently announced European-funded Nanopack project.

The project will address thermal problems that limit performance increases in semiconductors and power electronics. The company will reportedly develop technologies and materials for low thermal resistance interfaces and electrical interconnects.

In order to remove heat from assemblies, low thermal resistance interfaces need to be incorporated into high-density electrical interconnects. As an example, power electronics applications in hybrid vehicles and power supplies are reaching densities that are already being limited by the inability to transfer heat across interfaces to liquid coolers and heat sinks.

The Nanopack consortium, which includes MicReD and the Budapest University of Technology & Economics (BUTE), among others, will reportedly explore systems such as carbon nanotubes, nanoparticles and nano-structured surfaces combined with compatible manufacturing technologies to maximize the beneficial properties of the new materials.

Project results and information will be released through yearly Nanopack workshops.

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