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Imbera's IMB Technology Embeds Components in Substrate

Published: 17 March 2008
 by Staff

FINLAND - Imbera Electronics has introduced IMB, or Integrated Module Board technology, which reportedly allows the embedding of active and passive components inside an organic substrate.

According to the company, embedding components withn the substrate has many benefits, from reducing component area and compressing module size, to allowing  shorter interconnections, which reportedly minimizes distortion by reducing parasitics.

IMB technology also allows the embedding of EMI shielding that allows a claimed higher level of isolation from inductive and capacitive noise, eliminating the need for an additional surface-mounted shielding around a component.

Imbera was recently awarded The Frost & Sullivan Technology Innovation Award, for R&D that brings significant contribution to the industry in terms of adoption, change, and competition.
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