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  • How the PCB Stackup Helps Control EMI

    How the PCB Stackup Helps Control EMI

    Power and signal placed on outer layers minimize radiated emissions.
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  • Century Circuits

    Century Circuits

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    Learning from the Past

    What history can tell us about our position in high-tech.
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  • Thermal Vias are Ineffective. Here’s Why.

    Thermal Vias are Ineffective. Here’s Why.

    Adding thermal vias can take up valuable board space with little benefit.
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  • Connecting the Industry, from Boards to Assemblies

    Connecting the Industry, from Boards to Assemblies

    HDP is embarking on new rounds of evaluations of laminates and lead-free solders.
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Design News

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Category: Design News
LONDON - Mentor Graphics has resubmitted its unsolicited offer of approximately $46 million for the Flomerics Group, a bid that Flomerics has already rejected as too low.

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Category: Design News
SOUTHPOINTE, PA - Ansys Inc. has reported that the Securities and Exchange Commission had approved its planned acquisition of Ansoft Corp. for $832 million in cash and stock.

Ansoft stockholders will vote on the proposed deal on July 23.

Shares of Ansys rose 30 cents to $47.30 in after-hours trading, while Ansoft shares fell 2 cents to $36.45.

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Category: Design News
SMYRNA, GA – UP Media Group Inc. announced that registration is now open for PCB West 2008, scheduled for September 14-19, 2008, at the Santa Clara Marriott in Santa Clara, CA.

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Category: Design News
SEASIDE, OR - Written by Joseph Fjelstad in September 2006, the 3rd Edition of the book Flexible Circuit Technology features new chapters and authors that include: Flex Circuit Design Guide for Static and Dynamic Flexing by Werner Engelmaier of Engelmaier Associates, Process Challenges and System Applications in Flex by Kevin Durocher and William Burdick of GE Research, Flexible Circuit Assembly by Bob Willis of the SMART Group, and Solderless Assembly Processes for Flexible Circuits by Joe Fjelstad, developer of the Occam Process.

Reportedly to help assist in the adoption and implementation of flex circuit interconnection technology, the book and new chapters are available free of charge. PDF versions of both can be downloaded at flexiblecircuittechnology.com.
 
According to the book's sponsors,  the new chapters were written to address needs of both the newcomer and experienced engineer, while introducing new applications of the technology. Topics include new chip packaging and interconnection solutions, emerging printed electronics technologies, RFID and other applications.

The book is published by BR Publishing of Seaside, Oregon.

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Category: Design News
GREENVILLE, SC - The Kemet Corp. has introduced four new surface-mount MIL-PRF-123 space-level ceramic capacitors. The company claims that its M123A13BXB105KZ is the only 50V 1uF SMD ceramic capacitor in the marketplace qualified to the MIL-PRF-123 specification.

The products were developed in response to a Department of Defense request for ceramic capacitors that meet the space-level requirements of MIL-PRF-123. The company reports that it completed the MIL-PRF-123 qualification for the product, which included a claimed 4,000 hours of life testing at twice rated voltage at 125oC.

"This product announcement is an extension of Kemet's vision to become the number one preferred supplier of capacitors to the Defense and Aerospace market, and part of our larger commitment to be a technology leader in the industry," said company CEO Per Loof.

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Category: Design News
BANGALORE, INDIA - Ruwel GmbH of Geldern, Germany has announced that it has purchased an over 80% share in Naavinya CAD Soft Ltd. (NCS) located in Bangalore, India. The companies have also agreed on a buyer's option on the remaining 20%.

The company has stated that qualified engineers are currently in short supply in the rural areas of Germany, and the company decided to outsource additional need for job scheduling through a partnership in India. The company reports that the Indian engineers have more than two years experience in circuit board layout and design, and that the engineers will receive an additional three months training at Ruwel GmbH.

The company also reports plans to further expand its activities in Bangalore.

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