Log in / Register
  • Thermal Vias are Ineffective. Here’s Why.

    Thermal Vias are Ineffective. Here’s Why.

    Adding thermal vias can take up valuable board space with little benefit.
      READ MORE...

  • Connecting the Industry, from Boards to Assemblies

    Connecting the Industry, from Boards to Assemblies

    HDP is embarking on new rounds of evaluations of laminates and lead-free solders.
      READ MORE...

  • Exploring the Impact of AI

    Exploring the Impact of AI

    A special panel discusses the growth of AI tools and its possible effects on the industry.
      READ MORE...

  • A Journey in Rigid-Flex Design

    A Journey in Rigid-Flex Design

    Overcoming the challenges of rigid-flex designs can be incredibly rewarding.
      READ MORE...

  • Creating the Ultra Library

    Creating the Ultra Library

    Building and maintaining what's said to be the world's largest CAD database requires strong relationships.
      READ MORE...

Homepage Slideshow

Design News

Details
Category: Design News
SEASIDE, OR - Written by Joseph Fjelstad in September 2006, the 3rd Edition of the book Flexible Circuit Technology features new chapters and authors that include: Flex Circuit Design Guide for Static and Dynamic Flexing by Werner Engelmaier of Engelmaier Associates, Process Challenges and System Applications in Flex by Kevin Durocher and William Burdick of GE Research, Flexible Circuit Assembly by Bob Willis of the SMART Group, and Solderless Assembly Processes for Flexible Circuits by Joe Fjelstad, developer of the Occam Process.

Reportedly to help assist in the adoption and implementation of flex circuit interconnection technology, the book and new chapters are available free of charge. PDF versions of both can be downloaded at flexiblecircuittechnology.com.
 
According to the book's sponsors,  the new chapters were written to address needs of both the newcomer and experienced engineer, while introducing new applications of the technology. Topics include new chip packaging and interconnection solutions, emerging printed electronics technologies, RFID and other applications.

The book is published by BR Publishing of Seaside, Oregon.

Details
Category: Design News
GREENVILLE, SC - The Kemet Corp. has introduced four new surface-mount MIL-PRF-123 space-level ceramic capacitors. The company claims that its M123A13BXB105KZ is the only 50V 1uF SMD ceramic capacitor in the marketplace qualified to the MIL-PRF-123 specification.

The products were developed in response to a Department of Defense request for ceramic capacitors that meet the space-level requirements of MIL-PRF-123. The company reports that it completed the MIL-PRF-123 qualification for the product, which included a claimed 4,000 hours of life testing at twice rated voltage at 125oC.

"This product announcement is an extension of Kemet's vision to become the number one preferred supplier of capacitors to the Defense and Aerospace market, and part of our larger commitment to be a technology leader in the industry," said company CEO Per Loof.

Details
Category: Design News
BANGALORE, INDIA - Ruwel GmbH of Geldern, Germany has announced that it has purchased an over 80% share in Naavinya CAD Soft Ltd. (NCS) located in Bangalore, India. The companies have also agreed on a buyer's option on the remaining 20%.

The company has stated that qualified engineers are currently in short supply in the rural areas of Germany, and the company decided to outsource additional need for job scheduling through a partnership in India. The company reports that the Indian engineers have more than two years experience in circuit board layout and design, and that the engineers will receive an additional three months training at Ruwel GmbH.

The company also reports plans to further expand its activities in Bangalore.

Details
Category: Design News
MUNICH, GERMANY AND WESTFORD, MA - Zuken has partnered with Dassault Systèmes to launch Board Interchanger used for concurrent mechanical and PCB design. The software allows MCAD engineers access to Zuken's CR-5000 Board Designer within Dassault Systèmes' CATIA V5 software.

The company claims that the integration allows the MCAD engineer to set mechanical space requirements before the layout, helping to resolve 3D design issues earlier in the design process.

The company states that Board Interchanger uses the geometric data from CR-5000 Board Designer within CATIA V5 to allow 3D PCB models to be created. These models can then be used for mechanical design reviews of a completed electronic product. Board Interchanger also allows 3D collision checking between housing, components and other PCBs. There is also potential for reduction in board size through the product's concurrent mechanical and electronic design capabilities.

Details
Category: Design News
SAN JOSE, CA -- Cadence Design has submitted an offer to buy out Mentor Graphics, valuing its rival at $1.45 billion.

Read more ...

Details
Category: Design News
WILSONVILLE, OR -- Mentor Graphics confirmed that it previously rejected the unsolicited proposal by Cadence Design to acquire Mentor at a price of $16.00 per share.

Read more ...

Page 277 of 307