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Design News

Details: Written by Staff; Category: Design News; Published: 14 January 2009

PITTSBURGH, PA -- DesignAdvance Systems, Inc. has introduced a concept level planning tool for the hardware engineer. According to the company, CircuitPlan provides planning, feasibility and design collaboration capabilities from concept level planning through physical design and test.

"Our customers have been actively deploying our solutions [CircuitSpace and CircuitProbe] throughout their PCB design process," stated Mr. Edward Pupa, DesignAdvance CEO. "Now with CircuitPlan, we provide PCB designers, hardware engineers, test engineers and manufacturing engineers with solutions and an advanced methodology for planning, physical design, review / verification," continued Mr. Pupa.

CircuitPlan v1.0 will be available in February 2009.

Details: Written by Staff; Category: Design News; Published: 13 January 2009

WILSONVILLE, OR – Dr. Walden Rhines, chairman and CEO of Mentor Graphics Corp., will be the keynote speaker at DesignCon 2009, held February 2-5 in Santa Clara, CA.

In his address, Dr. Rhines will discuss issues confronting the EDA industry during these uncertain economic times. He will also offer provocative conclusions based on historical data and trends within the industry. The keynote will take place February 3, 11:50 a.m. to 12:30 p.m.

Details: Written by Administrator; Category: Design News; Published: 13 January 2009

EDINA, MN – SMTA has issued a call for 2009 abstracts for four educational conferences.

The International Conference on Soldering & Reliability takes place May 20-22 in Toronto. The deadline for abstracts is Jan. 16. (Contact This email address is being protected from spambots. You need JavaScript enabled to view it. to request an extension.) Visit http://www.smta.org/education/education.cfm#toronto for more information.

The International Wafer-Level Packaging Conference takes place Oct. 29-30 in Santa Clara, CA. The abstract deadline is Mar. 17. Visit http://www.iwlpc.com/call_for_papers.cfm.

The AIMS Harsh Environment Electronics Symposium takes place in conjunction with SMTAI in San Diego, Oct. 5-6. The deadline for abstracts for both is Mar. 27. Visit http://www.smta.org/education/education.cfm#aims and http://www.smta.org/smtai/call_for_papers.cfm to view the complete call and to submit an abstract.

Details: Written by Staff; Category: Design News; Published: 12 January 2009

SAN JOSE, CA -- The EDA Consortium announced that EDA industry revenue fell 10.9% to about $1.3 billion for the third quarter of 2008 and the four-quarter moving average declined 2.8%.

HERTFORD, ENGLAND – Daleba Electronics Ltd., a leading supplier of printed circuit boards (PCBs) in the United Kingdom, has promoted John Meyer to CEO. He joined the company in January 2008 as director of business development. As CEO, he will lead the company through the next stages of its growth and development.

Meyer brings over 25 years of experience in the electronics industry. Prior to joining Daleba, he worked for companies such as Arrow Electronics Inc., Philips and Electrocomponents.

SAN JOSE, CA – The Board of Directors at Cadence Design Systems Inc. has appointed Lip-Bu Tan as president and CEO, effective immediately. Tan had been serving as interim vice chairman of the Board and was a member of the Interim Office of the Chief Executive. He will retain his Board membership.

Design News

DesignAdvance Systems Introduces a Concept Level Planning Tool

Mentor's Chairman and CEO Keynote Speaker at DesignCon 2009

SMTA Issues 2009 Call for Abstracts

EDA Revenues Fall 10.9% in Q3 2008

Meyer CEO of Daleba

Cadence Names Lip-Bu Tan President and CEO

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