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  • Material Selection for High-Speed PCBs

    Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.  READ MORE...

  • Characterizing Etchback and Dielectric Loss Tangent

    Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.  READ MORE...

  • Sequential Lamination in PCB Manufacturing

    Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.  READ MORE...

  • Implementing Flash Memory in PCB Design

    Implementing Flash Memory in PCB Design

    Routing flash has EMI implications.   READ MORE...

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  • New Products

New Products

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TestScale modules can be combined in custom configurations to meet coverage needs and slot into small industrial chassis that connects to host PC using USB.

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RO3003G2 laminates now include a 9µm electrodeposited HVLP foil option. Are for antenna outer layers for millimeter wave radar PCBs, for example.

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UcamX Stencil seat includes all standard UcamX functionalities, supplemented with Stencil Toolbox.

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KW30 1mm-pitch wire-to-board connector is available in two to eight positions.

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EP2 tantalum capacitor is available with radial through-hole terminations with stud-mount option in B and C case codes.

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Details

Reactis stretchable film reportedly has excellent shape recovery and heat resistance.

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