Molex Quad-Row board-to-board connectors feature staggered-circuit layout.
Support compact form factors, including smartphones, smartwatches, wearables, game consoles and AR/VR devices. Pins are positioned across four rows at signal contact pitch of 0.175mm. Adhere to 3.0A current rating. Align with standard soldering pitch of 0.35mm to expedite volume manufacturing using typical SMT processes. Interior armor and insert-molded power nail safeguard pins from damage during volume manufacturing and assembly. Suited for applications requiring small PCBs and flex assembles. Are available in 32- and 36-pin configurations with 20- and 64-pin configurations coming soon. Plans are underway to support up to 100-pin counts.