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  • Material Selection for High-Speed PCBs

    Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.  READ MORE...

  • Characterizing Etchback and Dielectric Loss Tangent

    Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.  READ MORE...

  • Sequential Lamination in PCB Manufacturing

    Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.  READ MORE...

  • Implementing Flash Memory in PCB Design

    Implementing Flash Memory in PCB Design

    Routing flash has EMI implications.   READ MORE...

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New Products

Details
AVIA 355-23 solid-state UV laser delivers over 23W of Q-switched output at 355 nm, 15% more power than previous models and with higher pulse repetition rates. Features reportedly include short pulse duration, high beam quality and high pulse-to-pulse energy stability. Supports repetition rates of up to 300 kHz, and comes with a frequency-tripling component said to last 22,000 hrs.


For via-hole drilling in printed circuit boards and flip chips. Includes two-year warranty.

Details
IPC-7351A LP Wizard is for the CR-5000 PCB and advanced packaging suite. This land pattern generator is said to reduce the time it takes to build a standard SMT footprint/symbol for a library part; ensures compatibility with the latest IPC standard for surface mount design. The task reportedly takes less than a minute. Consists of land pattern viewers, calculators and generators for the creation of CAD land patterns, including pads, padstacks and footprints/symbols in SMT parts libraries. Dovetails with free IPC library documentation and viewer provided with IPC-7351 standard. Data can be shared with engineers throughout organization on a project-by-project basis.

PCB Libraries, www.pcblibraries.com

Details
Accumax Photoplotter Film ABG7 1907 combines sensitivity of blue and green lasers, reportedly demonstrating faster speed and wider exposure latitude for use in electronics manufacturing. Builds on technology used in ARD7 film. Designed for use on blue and green laser photoplotters; said to be for production of smaller and more complex PCBs. Improved fine-line image consistency combined with integrated booster technology processing. Sensitometric contrast is said to be improved. Will replace ABX7 and AGX7.

Eastman Kodak Company, www.kodak.com

Details
The Traceability and Control Validation Kit is designed to validate manufacturing process and provide the potential for rich product and process traceability detail. Is reportedly the first measurement tool for manufacturers to validate their plants’ traceability and control based on rating traceability. Is designed to help engineers quickly find key products needed to qualify their assembly technology. Is also said to provide the physical materials and procedural guide to determine a factory’s traceability and control capability, and to rate the results in a formalized matrix.

Aegis Industrial Software Corp., www.aiscorp.com

Practical Components Inc., www.practicalcomponents.com

Details
CM10 has been specifically designed for simultaneous double-sided cleaning of large format substrates. Applications include PCBs, flat panel displays, screen printing, LCDs, lamination, packaging and glass manufacture. Has elastomer contact cleaning rollers and adhesive system. Four large-diameter elastomer rollers are said to remove unattached particles down to one µm and transfer them to a high coat weight, pre-sheeted, reverse-wound adhesive roll. Analysis and assessment of the source of contamination is made possible. Has cleaning module tilt system. Includes 7kv anti-static system. Operation up to 40 m/min.
 


 

Details
SIwave v3.5 is a full-wave electromagnetic field simulator optimized for signal-integrity, power-integrity, and electromagnetic interference analysis of high-speed PCBs and IC packages. Features a finite-element-based DC solver optimized for extraction of power rail geometry in low-voltage/high-current PCBs and packages. Engineers reportedly can view voltage and current distributions in all relevant geometry, including vias and bond wires; have access to voltage drop and current flow information through vias, bond wires, sources, resistors, inductors, etc. in tabular format. Said to simulate electromagnetic behavior of complex PCBs and IC packages, including multiple, arbitrarily shaped power and ground layers, and any number of vias and signal traces. Full-wave S-, Y- or Z-parameters or GHz-bandwidth circuit model is used in concert with time- and frequency-domain analyses within Nexxim and DesignerSI or third-party SPICE-compatible circuit tools. Highlights include 64-bit capability; frequency-dependent source implementation; linear interpolation; frequency-dependent material model (Djordjevic-Sarkar); visualization of near E and H fields, and clip design tool. 

Ansoft Corp., www.ansoft.com/siwave

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