Printed Circuit Design & Fab Online Magazine - New Products

New Products

WILSONVILLE, OR – LPKF’s MicroLine UV 3000 is a compact laser system designed to cut precise openings in polyimide coverlayer foils and to cut flex circuits. It reportedly reduces product changeover time.

The MicroLine UV 3000 contains a new high speed linear drive for flexible circuits, featuring greater positioning accuracy, higher speed and faster acceleration resulting in reduced processing times. It is said to encompass tools with the ability to perform precision cutting, routing, skiving, drilling, cutting pockets, structuring of etch/solder resist, micromachining of ceramic substrates and more.

Vice President of Sales Jim Greene said, “These capabilities noticeably reduce changeover time, making it an efficient component of any fabrication process, especially where physical space is a premium.”

CARSON CITY, NV – Taiyo America has released PSR-9000FXT, a liquid photoimageable covercoat or soldermask for flexible printed circuit boards. It is said to have excellent flexibility and low warpage throughout the fabrication process for high yields, as well as flexibility after cure.

PSR-9000 FXT is available in amber and green colors, and is RoHS compliant. A laser direct imaging version of this product is available called PSR-9000FXT LDI that has the same properties as the standard product.

KEMPEN, Germany – Lackwerke Peters GmbH has released Elpeguard conformal coatings for the SL 1400 ECO-FLZ series. The one-pack conformal coatings are said to exhibit optimum climatic protection at high temperatures and high humidity (85 °C/85 % relative humidity), making them suited to meet the highest requirements of electrical properties.

Application is effected in standard layer thicknesses of approx. 30 µm. After application, the conformal coatings initially cure physically and then finally cure by reacting with humidity. They are colorless transparent conformal coatings based on chemically reacting polyurethane resins.

The coatings are also ecologically advantageous products. They have a high solids content, are free of aromatic solvents and heavy metals, and fulfill the requirements of the RoHS directive 2002/95/EC and the WEEE directive 2002/96/EC.

SAN JOSE – Sanmina-SCI Corp. has launched MTS-Via to improve the signal integrity of high-speed data links in printed circuit boards.

MTS stands for match terminated stub, which uses resistors embedded in the internal PCB layers to eliminate parasitic reflections that can interfere with data signals. The approach is said to be less expensive and complex than other effective methods, such as backdrilling, particularly as the number of high-speed signals increases.

The company reported the patent-pending MTS-Via will work in tandem with Opti-Via, another new technology. Opti-Via is designed to improve signal integrity by optimizing internal layer features.

SANTA ROSA, CA – Schurter’s new series DD21 and DD22 power entry modules were designed for PCB mounting. The DD21 is equipped with multiple functions including inlet connector, switching and fusing. In addition, the DD22 series offers standard or medical filter versions. The compact design of this series is said to make them ideally suited for use in low profile designs, especially 1RU enclosures for 19” racks, and IT and telecom infrastructures where equipment is continually downsized.

The DD series can be equipped with 1- or 2-pole fuse holders for 5 x 20 mm fuse-links. The 2-pole switch, which is designed for inrush current peaks of 100 A capacitive for 3 ms, is available in both illuminated and non-illuminated versions. The DD21 is rated for currents at 8 and 10 A, while DD22 series is rated for currents at 1, 2, 4, 6, 8 and 10 A. The power entry modules fulfill IEC/EN 60950 requirements and are ENEC and UL/CSA approved up to 10 A 250 VAC 50 Hz and 8 A 125/250 VAC 60 Hz respectively. Special configurations such as protection class II (IEC 61140) arrangements or filters with special X1 capacitors for increased dielectric strength are available.

The DD series uses M3 or self-tapping screws for mounting onto a PCB or M3 screws for mounting from the rear of the housing. The compact series requires minimal space having a board footprint of 65 mm wide x 34.6 mm deep, and panel cutout of 28.1 mm x 47.1 mm. Applications for this product include industrial PCs, digital audio applications, network routers, analog televisions and battery charging equipment.

BERLIN – Atotech’s Inpulse 2HF electrolyte coupled with the Uniplate InPulse 2 is said to be ideally suited for blind microvia filling. The process reportedly enables “super filling” which gives unrivalled productivity and blind microvia filling with half the copper plating thickness in comparison to standard processing.

According to the company, the product features savings in soldermask, etching chemistry and processing time, as well as 50% less Cu plating. Other reported benefits include minimal Cu plated on surface, high productivity, excellent surface uniformity, proven in HDI production, 2 mil line and space performance