BEAVERTON, OR - Polar Instruments releases Speedstack 2.0, an automated PCB stack-up creation tool. Accoording to Polar the tool reduces the time required for electronic engineers or PCB fabricators to create and document multi-layer printed circuit board stackups.

Speedstack uses basic information such as the overall board thickness, number of layers and target impedance to generate a number of virtual stacks based on a library of generic or real-time material costs, availability and lead-times. Users then balance different criteria by ranking the potential stacks by cost, finished thickness, or the availability of materials. Speedstack 2.0 has an autostack VSR (Virtual Stack Realization) engine that performs a Monte Carlo analysis on 10,000 virtual builds of each stack to provide a statistical profile of board thickness and an accurate prediction of production yields.

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