PITTSBURGH – DesignAdvance Systems Inc. has released CircuitSpace 2.1, a design automation tool for PCB component placement. CircuitSpace 2.1 is said to improve PCB design automation through patented auto-clustering technology, intelligent design reuse and replicated layout. Designers are reportedly able to shorten design cycle timelines by weeks and improve communication between design teams, saving design costs and improving productivity. “Since the initial release of CircuitSpace, we have worked closely with our customers in developing next generation of advanced automation technologies for PCB component placement,” said Edward Pupa, DesignAdvance’s CEO.
CircuitSpace v2.1 implements a hierarchical approach to printed circuit board design through enhanced autoclustering, intelligent design reuse and replication technologies. Reported capabilities of CircuitSpace v2.1 include:
AutoClustering
Intelligent physical design reuse and replication
Concurrent layout development project wide
Template generation for global library usage across divisions
GARDEN GROVE, CA – OK International has introduced its new DX-350 Series of digital dispenser/controllers. The microprocessor-driven, fully digital DX-350 series reportedly dispenses precise fluid volume with consistently high accuracy and repeatability. The system will be fully available in the second quarter.
The new series is comprised of the DX-350 and the DX-355 dispenser/controllers. With an operating pressure of 0-100 psi, the DX-350 is designed to dispense a wide range of fluid viscosities, while also controlling variation in pneumatic dispense valves. The DX-355, with an operating pressure of 0-15 psi, has been specifically developed for low viscosity fluid dispensing.
The DX-350 Series is said to guarantee size shot accuracy and control of drips between cycles through the standard inclusion of a digital timer, digital pressure and vacuum read out. In addition, the software further promotes ease-of-use with 10 programmable memories capable of storing and recalling the most frequently used dispensing cycle.
Product application is diverse, ranging from the precision deposition of surface mount solder paste and adhesive, to semiconductor under-fill in electronic workbench assembly. Operating from a 24V DC supply and supplied ready to use with a power adapter, air hose, sample tips, barrel, syringe adapter and syringe stand, the CE certified dispensers feature a timer range of 0.0080 to 60.00s. to further maximize operator flexibility.
The series’, robust housing is designed to optimize bench top efficiency. Since each unit can be stacked and fastened on top of each other and easily carried between work locations, its small footprint is ideal for manufacturers looking to conserve workspace.
MARLBOROUGH, MA – Flomerics Inc. has released Version 7 of its Flotherm electronics thermal analysis software featuring a Response Surface Optimization capability that the company believes is unrivalled in computational fluid dynamics (CFD) analysis software. The Response Surface Optimization fits a 3D surface to the entire design space, reportedly enabling engineers to visualize the complete interaction of the design parameters with the design goal as well as identifying the optimum to a greater degree of accuracy.
The user begins Flotherm’s optimization process by defining design goals in the form of a “cost function”, and the ranges over which key design parameters may be varied. The cost function may be a single, simple value such as the junction temperature of a particular component, or a complex linear combination of values including weighting. Flotherm automatically creates and runs the required number of simulations to explore the entire design space in the most cost-effective way.
The optimization module then generates a “response surface” showing the value of the design goals for all the combinations of variables that were run. The response surface can be viewed through either a 2D or 3D chart window, said to make it easy to visualize the sensitivity of the cost function to changes in particular design parameters. The optimum value of the cost function is automatically identified and saved as a new project file. This project file can then be solved to confirm the global optimum.
Common real-world applications of the optimization process include: heatsink design, PCB component placement, fan/blower selection and the location of vents.
Flotherm Version 7 includes a new SmartPart that models heat pipes accurately and the ability to import 2D DXF files and extrude them directly into 3D shapes. The all-new Visual Editor post-processing window features “fly-through” and “fly-by” results animation, a new data entry/edit method based on property sheets, a Japanese user interface and other performance-enhancing features.
NEWBERG, OR – WISE Software has released VisualCAM 2006 and GerbTool 15.1that are fully compatible with the Microsoft Windows Vista operating system. In addition, the 15.1 release offers improvements to WISE Software’s Blind & Buried Via support during the import of IPC-D-356 data. There are also enhancements to the Test Fixturing capabilities (VisualCAM only), which reportedly allow for better End-Point Detection, the use of Solder Mask Data as test location filters, and more.
“WISE Software has always been committed to insuring the highest level of compatibility with the Windows operating system,” says Andy Wise, president of WISE Software Solutions Inc. “For this release we have made the necessary changes to our installation process to ensure that GerbTool and VisualCAM are being placed properly within the Vista environment. This includes making sure that all necessary drivers, for compenents like hardware keys and FlexLM, have been updated and tested for Vista compatibility.”
Blind & Buried Via Improvements: As design complexity continues to increase, so do the use of blind and buried vias. The 15.1 release offers improvements to the handling and association of external netlist information when an IPC-D-356 file is imported for comparison purposes. Users are said to receive a cleaner and more accurate display representation of their blind and buried via points and how they relate to internal layers. As the user cycles through their inner layers, they are shown only the external net points that pertain to those layers. Net points for blind and buried vias are represented with a unique marker that helps the user to distinguish them from a standard through-hole location.
Test Fixturing Enhancements:WISE has improved end-point detection to help eliminate unwanted or redundant testing of points on a given net. Algorithms have been improved so that, as a net traverses a board and passes through vias to other layers, these points are not inadvertently treated as the end of that net for that particular layer. VisualCAM will continue to track the net to see if it resurfaces elsewhere, thus allowing VisualCAM to continue its tracking and tag the true end point more accurately.
New Assembly Analysis: This release includes new Assembly Analysis features that reportedly provide a flexible method of checking the spacing between devices on the board. Multiple spacing checks are supported, including: 1) pin to pin, 2) pin to outline and 3) outline to outline. Selection of groups of devices or specific devices to participate in a check is simple and straightforward while still enabling the user to rapidly define a complex set of checks to meet their requirements. Additionally, sets of checks can be saved to external files.
FARMINGDALE, NY – Multiline Technology has launched its new XRT System 7000, the next generation in x-ray drilled tooling and inspection.
The XRT System 7000 was designed to help PCB manufacturers reduce their registration budgets to the absolute minimum when fabricating high layer count multilayers, HDI circuits, and laminated circuits with blind and buried vias.
It is reported that high throughput combined with Multiline's state-of-the-art high-resolution x-ray imaging capability, and a series of available software options (layer analysis, run analysis, multiline predictive registration software and registration design rule check), makes the Multiline XRT System 7000 a valuable addition to any fabricator interested in improving yields, adding to material and registration know-how and increasing production capacity.
SEASIDE, OR – A hard copy version of Flexible Circuit TechnologybyJoe Fjelstad is now available in paperback. Flexible Circuit Technology, 3rd Edition is said t be a must-read for those looking to understand this enabling interconnection technology. Hard copies of this flex industry guidebook have been requested by many companies as well as Flex Circuit professionals.
The new hard copy edition is has been expanded to include both emerging manufacturing technologies and a wide range of new applications for flexible circuits. The book, written to address the needs of both the newcomer and the seasoned engineer alike, reportedly opens doors to the latest applications of this adaptable technology, including new chip packaging and interconnection solutions, emerging printed electronics technologies, RFID as well as other novel applications.
