IPC-7351A LP Wizard is for the CR-5000 PCB and advanced packaging suite. This land pattern generator is said to reduce the time it takes to build a standard SMT footprint/symbol for a library part; ensures compatibility with the latest IPC standard for surface mount design. The task reportedly takes less than a minute. Consists of land pattern viewers, calculators and generators for the creation of CAD land patterns, including pads, padstacks and footprints/symbols in SMT parts libraries. Dovetails with free IPC library documentation and viewer provided with IPC-7351 standard. Data can be shared with engineers throughout organization on a project-by-project basis.
Accumax Photoplotter Film ABG7 1907 combines sensitivity of blue and green lasers, reportedly demonstrating faster speed and wider exposure latitude for use in electronics manufacturing. Builds on technology used in ARD7 film. Designed for use on blue and green laser photoplotters; said to be for production of smaller and more complex PCBs. Improved fine-line image consistency combined with integrated booster technology processing. Sensitometric contrast is said to be improved. Will replace ABX7 and AGX7.
The Traceability and Control Validation Kit is designed to validate manufacturing process and provide the potential for rich product and process traceability detail. Is reportedly the first measurement tool for manufacturers to validate their plants’ traceability and control based on rating traceability. Is designed to help engineers quickly find key products needed to qualify their assembly technology. Is also said to provide the physical materials and procedural guide to determine a factory’s traceability and control capability, and to rate the results in a formalized matrix.
CM10 has been specifically designed for simultaneous double-sided cleaning of large format substrates. Applications include PCBs, flat panel displays, screen printing, LCDs, lamination, packaging and glass manufacture. Has elastomer contact cleaning rollers and adhesive system. Four large-diameter elastomer rollers are said to remove unattached particles down to one µm and transfer them to a high coat weight, pre-sheeted, reverse-wound adhesive roll. Analysis and assessment of the source of contamination is made possible. Has cleaning module tilt system. Includes 7kv anti-static system. Operation up to 40 m/min.
SIwave v3.5 is a full-wave electromagnetic field simulator optimized for signal-integrity, power-integrity, and electromagnetic interference analysis of high-speed PCBs and IC packages. Features a finite-element-based DC solver optimized for extraction of power rail geometry in low-voltage/high-current PCBs and packages. Engineers reportedly can view voltage and current distributions in all relevant geometry, including vias and bond wires; have access to voltage drop and current flow information through vias, bond wires, sources, resistors, inductors, etc. in tabular format. Said to simulate electromagnetic behavior of complex PCBs and IC packages, including multiple, arbitrarily shaped power and ground layers, and any number of vias and signal traces. Full-wave S-, Y- or Z-parameters or GHz-bandwidth circuit model is used in concert with time- and frequency-domain analyses within Nexxim and DesignerSI or third-party SPICE-compatible circuit tools. Highlights include 64-bit capability; frequency-dependent source implementation; linear interpolation; frequency-dependent material model (Djordjevic-Sarkar); visualization of near E and H fields, and clip design tool.
The Niton XL3 Series third-generation handheld XRF analyzer is said to provide the fastest solder alloy grade identification and laboratory-quality composition analysis of plastics and polymers. Typical time for routine solder screening measurements is said to be less than 5 sec. Features a 50 kV, 2W x-ray tube. Comes in a range of configurations with an assortment of optional features and accessories; quick screening to simultaneous measurement of up to 25 elements in a sample. Offers component testing; solder analysis; populated PCBs and finished goods; hi-reliability screening.