The latest release of ExpressPCB Plus layout software, version 3.2.0, brings improved performance and flexibility for designers.

Siemens' incorporation of the Supplyframe Design-to-Source Intelligence platform with the Xpedition software for electronic systems design facilitates supply chain resilience by providing real-time visibility into global component availability, demand, cost, compliance and associated parametric data at the point of design.

Stackpole’s RNCL thin film high power anti-surge chip resistors provide high power ratings per chip size with resistance values down to 50mΩ.

OKI Electric Cable's two new environment-proof FPC (flexible printed circuit) products are designed for use under harsh conditions, including the conditions found in high-temperature and high-pressure steam environments.