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  • Material Selection for High-Speed PCBs

    Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.  READ MORE...

  • Characterizing Etchback and Dielectric Loss Tangent

    Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.  READ MORE...

  • Sequential Lamination in PCB Manufacturing

    Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.  READ MORE...

  • Implementing Flash Memory in PCB Design

    Implementing Flash Memory in PCB Design

    Routing flash has EMI implications.   READ MORE...

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  • New Products

New Products

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Würth Elektronik's MEMS (Micro-Electro-Mechanical System) sensor measures with a precision of ±1.8% RH in the 20% to 80% relative humidity range.

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Würth Elektronik’s online design platform Redexpert now includes the effects of DC bias on the AC losses.

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Amphenol Socapex's USB3CFTV is a ruggedized USB Type-C connector designed to withstand harsh environments and demanding applications such as military communications, military planes, aerospace, commercial air and naval applications.

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Vishay Intertechnology's TSOP18xx, TSOP58xx, and TSSP5xx series of IR receiver modules now feature the company's latest in-house IC technology.

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Altium's BOM Portal within the Altium 365 platform is designed to enhance collaboration between engineering and procurement teams and offer a unified approach to managing Bills of Materials (BOMs).

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Yamaichi Electronics' YFLEX flexible PCB is now also available as a high-heat resistant version for extreme environments.

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