Press Releases

Atlanta - In collaboration with Electronics Sourcing magazine, ECIA Chief Analyst Dale Ford has completed a report based on research to identify the Top 50 Global Distributors. This report appears in the September 2021 issue of Electronics Sourcing, and is also available at ESNA Top 50 Global Report.

Read more: ECIA’s Dale Ford Completes Top 50 Global Distributor Report

IPC adhering to California Dept. of Public Health guidelines

Read more: Proof of COVID Vaccination or Negative Test Required to Attend IPC APEX EXPO 2022

Nano Dimension Announces Collaboration with Fraunhofer Institute to Develop the Next Generation of 3D Printing Systems

Read more: Nano Dimension Announces Collaboration with Fraunhofer IPA to Develop the Next Generation System

The International Tin Association (ITA) is pleased to announce that the Tin Code Standard 7.3 has been conditionally approved by the London Metal Exchange (LME) for use by brands under ‘alignment-assessed standard Track A’ of the LME Responsible Sourcing Rules.

Read more: LME recognises ITA Tin Code standard to demonstrate responsibly sourced tin

IDTechEx released its latest research on the commercialization of flexible, wearable, and smart skin patches.

Read more: Report: Electronic Skin Patch Revenue to be Over $30B by 2031

AGC Multi Material America, Inc. is proud to announce that effective September 1, 2021, they will be partnering with Tritek Circuit Products. Tritek will become the West Coast distributor for AGC Multi Material America’s digital laminate and prepreg materials.

Read more: AGC Multi Material America Announces Partnership with Tritek Circuit Products

Page 114 of 318

Subcategories