Press Releases

Imaging specialist Altix secures European client with its new AcuReel XL

Read more: Altix receives new order for its AcuReel XL imaging system

Sunrise, Florida, July 2021 – Nano Dimension Ltd. (Nasdaq: NNDM), an industry leading Additively Manufactured Electronics (AME)/PE (Printed Electronics) provider, today announced a new webinar based on the successful AME Academy presentation. The webinar, entitled “What Is AME and Its Impact on the Industry Roadmap?” is scheduled to take place Thursday, July 29, 2021 at 10 a.m. EST.

Read more: Nano Dimension Presents: “What Is AME and Its Impact on the Industry Roadmap?”

Leoben, July 12, 2021 - Innovative strength, technology leadership, and solution orientation have made AT&S one of the world's largest and most successful suppliers of advanced interconnect technologies. With its current expansion step - a new plant for IC substrates - AT&S is expanding its geographical footprint and will be represented in Malaysia in the future. During a visit to AT&S's Group headquarters in Leoben Hinterberg, a delegation from the Malaysian Senior Minister of Economy and Industry, Dato' Seri Mohamed Azmin Ali, was able to see for themselves AT&S's innovative strength and to discuss further cooperation steps and future projects with the Management Board team. Also present at the meeting were Hannes Androsch, Chairman of the AT&S Supervisory Board, Willi Dörflinger, Honorary Member of the Supervisory Board, Horst Bischof, Vice-Rector Graz University of Technology, the Malaysian Ambassador Dato' Ganeson Sivagurunathan, and the CEO of The Malaysian Investment Development Authority (MIDA) Mr. Arham Abdul Rahman. The Austrian Federal Economic Chamber was represented by President Harald Mahrer; the Chamber was an important partner for AT&S in the global scouting for the location decision for the new plant.

Read more: AT&S Austria Technologie & Systemtechnik: Close cooperation agreed – Malaysian Senior Minister of...

Summit Interconnect is proud to announce that its Santa Clara division successfully completed certification for IPC-1791, meeting stringent requirements for the electronics industry’s most comprehensive system for supply chain security. This coveted designation earns Summit- Santa Clara a spot on IPC’s Qualified Manufacturer’s List (QML) as a trusted electronic fabricator for markets requiring a high level of data security and assurance of manufacturing integrity.

Read more: Summit Santa Clara Completes IPC-1791 Certification

Exposure systems specialist Altix dedicates entire new wing to R&D

VAL-DE-REUIL, July 7th 2021

Read more: Altix moves to increase its R&D capabilities

Leoben, July 5, 2021 – The image sensor is smaller than a grain of rice, lighter than a postage stamp but more powerful than any previous development of its kind. With a size of 1 mm² and a weight of about 1 gram, the image sensor is so small that it can not only be installed in smartphones, VR cameras, and other wearables but can also be integrated into medical applications such as endoscopes.

Read more: AT&S technology enables the world's smallest digicam

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