Log in / Register
  • What is Ultra HDI?

    What is Ultra HDI?

    With Ultra HDI, small features come with big decisions.  READ MORE...

  • The Critical Nature of PCB Stackup

    The Critical Nature of PCB Stackup

    The stackup supports every layer above it.  READ MORE...

  • The PCB Design Review Process

    The PCB Design Review Process

    A structured design review process ensures alignment.  READ MORE...

  • Metal-Core PCBs and Thermal Management

    Metal-Core PCBs and Thermal Management

    Catch heat at the board.  READ MORE...

Homepage Slideshow
  • Home
  • Current
  • Umicore MDS successfully installs the Uyemura Thru-Cup® EVF-YF9 process at Hi-Tech Corporation – a strong signal for Europe's printed circuit board industry

Press Releases

Details
Category: Press Releases

(Waterbury, CT USA) – Nov 2nd, 2021 – MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering, sintering and bonding materials, has announced a cooperation with STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, on a key sinter technology for Electric Vehicle inverter assemblies, designed to significantly increase vehicle efficiency and range, and lower production costs.

Read more: MacDermid Alpha Collaborates with STMicroelectronics to Improve Performance of EV Inverter...

Details
Category: Press Releases

Isola Group (www.isola-group.com), a global innovator in materials for printed-circuit boards (PCBs), will be showing a wide range of its wares at the upcoming Productronica 2021 exhibition. Scheduled for November 16-19, 2021, at the Messe Munchen (Munich, Germany), Productronica (www.productronica.com) is one of the world’s leading trade fairs for electronics and already offers more than 860 exhibitors for the 2021 event, which is co-located with SEMICON Europa. Isola, located at Productronica 2021 booth B3.226, will be represented by its European division, Isola GmbH.

Read more: Isola Shows Myriad of Materials at Productronica 2021 Exhibition

Details
Category: Press Releases

AUSTIN, Texas, Nov. 1, 2021 /PRNewswire-PRWeb/ -- High Density Packaging (HDP) User Group is pleased to announce that Co-Tech Development (Co-Tech) has become a member.

Read more: HDP User Group Announces Co-Tech Development Membership

Details
Category: Press Releases

Imaging Business Unit to upgrade its Electronic Design Environment with Zuken’s CR-8000 and DS-CR

Read more: Panasonic and Zuken Complete Agreement for Electronic Design Solution

Details
Category: Press Releases

CHENNAI: KLA Corporation, a solutions provider for the global semiconductor and chips industry, has opened two new facilities in Chennai to strengthen its research and talent development.

Read more: Tamil Nadu: KLA Corporation opens two new facilities in Chennai

Details
Category: Press Releases

ATLANTA – ECIA has been tracking member responses to workplace disruptions caused by the pandemic by means of a survey conducted with industry company management during early Aug 2021 and again in late Sep 2021. ECIA’s Chief Analyst Dale Ford discusses the survey results in a webinar recording now available at 2021 Oct 19 Results from Survey on Business Operations Post-Covid on Vimeo.

Read more: ECIA Posts Workplace Survey Results Webinar Recording

Page 113 of 324

Subcategories