WALTHAM, MA – Nano Dimension Ltd. (Nasdaq: NNDM, “Nano Dimension” or the “Company”), a leading supplier of Additively Manufactured Electronics (“AME”) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (“AM”) 3D printers, announced that it has inaugurated its new European headquarters in Munich, Germany to further its commercial and research and development (“R&D”) efforts.
Munich was chosen given its prominence as a technology and manufacturing hub for Germany and the European region. Nano Dimension will be able to provide unmatched service and responsiveness to the many current and potential customers in proximity to the headquarters. The Company also expects to make great strides in Advanced Material R&D, thanks to the leading research institutions, materials companies, and strong industrial and technology workforce that exist specifically in Munich and the State of Bavaria.
To match the significance of the event, the State of Bavaria’s Minister of Economic Affairs, Herr Hubert Aiwanger, was the Company’s guest of Honor. Minister Aiwanger commented, “The combination of 3D printing and electronics manufacturing fits perfectly with Bavaria's high-tech agenda. In particular, in the area of microelectronics, Bavaria aims to strengthen its position. This technology even allows for the production and competence in the field of microelectronics to be partly brought back to Bavaria.”
Ziki Peled, President of Nano Dimension EMEA, added, “Germany has long been a strategic focus for Nano Dimension. The concentration of our commercial and R&D relationships is hard to beat. We are happy to cement our work in the country and region by establishing our new headquarters in Munich in the State of Bavaria. This city and region are at the forefront of two aspects that define Nano Dimension – technology and manufacturing. We look forward to being even closer to the people we work with already and hope to work more with in the future.”
This newest development complements the Company’s strong presence in the United States, the United Kingdom, Switzerland, Netherlands, Australia and Israel.
TOKYO – Toppan (TYO: 7911), a global leader in communication, security, packaging, décor materials, and electronics solutions, has been recognized for the second consecutive year as a Supplier Engagement Leader in the 2022 Supplier Engagement Rating (SER) conducted by CDP, an international non-profit organization focused on environmental disclosure.
CDP’s Supplier Engagement Rating assesses how effectively companies are working with suppliers to address climate change issues. Specifically, it focuses on the five areas of governance, targets, scope 3 emissions,1 supplier engagement, and overall CDP climate change performance. In the 2022 assessment, CDP named the top 8% of responding companies as Supplier Engagement Leaders. Toppan was recognized in particular for proactive efforts to reduce supply chain greenhouse gas (GHG) emissions across its global group of companies through the provision of low-carbon-emission products and services.
“We are very pleased that CDP has recognized Toppan as a leader in supplier engagement for consecutive years,” said Fumie Ikeda, General Manager of Sustainability Promotion at Toppan. “We will continue to accelerate ESG initiatives, work with stakeholders to enable a sustainable society, and enhance transparency in disclosure as we aim to be a leading provider of solutions to climate change and other issues globally based on digital and sustainable transformation.”
Sustainability at Toppan
Aiming to help shape a sustainable society through business activities conscious of the need for conservation of the global environment, Toppan formulated the Toppan Group Environmental Vision 2050 in January 2021, setting out its long-term approach to environmental issues. At the same time, Toppan revised and set new medium-and-long-term target figures, including those for GHG emission reduction, to be achieved by 2030, the target year for the Sustainable Development Goals (SDGs).
In recognition of the size of the impact that climate change can potentially have on the Group’s operations, Toppan also conducts scenario analysis based on the recommendations of the Task Force on Climate-related Financial Disclosures (TCFD) and discloses information in line with the four thematic areas of governance, strategy, risk management, and metrics and targets.
1. Categorization of greenhouse gas emissions Scope 1: Direct emissions from owned or controlled sources. Scope 2: Indirect emissions from the generation of purchased electricity, steam, heating and cooling consumed by the reporting company. Scope 3: All other indirect emissions that occur in a company’s value chain.
WALTHAM, MA – Nano Dimension Ltd. (Nasdaq: NNDM, “Nano Dimension” or the “Company”), a leading supplier of Additively Manufactured Electronics (“AME”) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (“AM”) 3D printers, are releasing videos addressing vision, plans and answering likely questions.
A longer video which unpacks the topics discussed in greater length will be released very shortly. Please refer to the Nano Dimension YouTube channel for this and all other videos: https://www.youtube.com/@NanoDimension
In these videos, Nano Dimension's Chairman and Chief Executive Officer Yoav Stern provides clear and concise vision and strategy for the combined company, clear ups any doubts, and eradicates misconceptions.
We believe that this initiative will promote transparency and reinforce our commitment to keep our shareholders well-informed, rather than repetitively exposed texts written by Mr. Bistricer assistants (i.e. Moshe Zarfati) and/or Anson Funds employees, who seem to be even more confused than their mutual or coordinated partner.
CHICAGO – West Chicago based printed circuit fabricator American Standard Circuits has attained their ISO 13485:16 medical certification. ISO 13485:2016 specifies requirements for a quality management system where an organization needs to demonstrate its ability to provide medical devices and related services that consistently meet customer and applicable regulatory requirements.
President and CEO, Anaya Vardya commented, “This certification represents a great deal of work and dedication from all our team members. They all put together a tremendous effort to reach this goal. It is my understanding that there are very few printed circuit board companies (If any in North America) that have earned ISO 13485:16 Medical Certification which makes us stand out as a preferred medical electronics circuit board provider. As we continued to grow our medical business exponentially, we felt that this certification would go a long way in establishing our leadership in this marketplace. Now that we have made the investment in time and people to accomplish this certification we look forward to meeting and working with even more medical electronics companies.”
CHANDLER, AZ – Rogers Corporation (NYSE:ROG) will exhibit at the GOMACTech 2023 conference at Town & Country in San Diego, CA (Booth #509), March 21st & 22nd , highlighting laminate and film materials for use in the advanced packaging industry, used in C4ISR applications in the Ground, Air, Sea and Space domains.
GOMACTech is a premier event focused on developments in microcircuit applications for government systems.
Some of Rogers’ products being highlighted include:
Recently introduced Radix™ 3D Printable Dielectrics family of products, is the first available material featuring a dielectric constant of 2.8 and low loss characteristics at microwave frequencies. These printable dielectric materials give radio frequency (RF) designers unprecedented design freedom in creating new components, eliminating the need to consider typical manufacturing design constraints. Radix 3D Printable Dielectrics are proprietary composite materials designed for Digital Light Processing (DLP) 3D printing, enabling a scalable, high-resolution printing process for end-use RF dielectric component manufacturing. Rogers Corporation’s first Radix 3D Printable Dielectric material has a targeted dielectric constant of 2.8 and a dissipation factor of 0.0043 at 10 GHz when cured.
MAGTREX ® 555 High Impedance Laminates: The first commercially available low loss laminate with controlled permeability and permittivity, enabling antenna designers to expand the trade-space of their antenna design, enabling design flexibility and optimization.
Rogers technical staff will be available to discuss your most demanding applications from Build-Up materials for advanced packaging solutions, Phase Array Radar solutions, high frequency magneto- dielectric materials, ablative Radome materials, and metallized-shaped/3D ADM dielectric solutions.
CAMBRIDGE, UK – Integrating multiple functionalities within a single entity promises simpler, more efficient devices without compromising capability. Smartphones are a great example, with maps, diaries, phones, cameras, games consoles, and more integrated into a single, compact device. However, the smartphone itself is arguably a masterpiece of packaging, containing many different components from different suppliers that are mounted onto a chassis.
What if, rather than assembling numerous subsidiary components and ensuring electrical connectivity, the functionality was integrated into the object itself? This is the promise of ‘3D electronics’, where the boundaries between mechanical and electrical design fade away and components have the electronic functionality embedded within them. This approach can be applied to many length scales, with electronic functionality in the form of conductive inks and components are applied onto the surface of 3D objects, termed ‘partially additive’, or incorporated internally (termed ‘fully additive’, akin to 3D printing with electronics included).
In-mold electronics (IME) is a third approach to producing embedded electronics, generally in the form of smart surfaces with integrated lighting and capacitive touch sensors. With IME, conductive inks are printed and components are optionally mounted onto a flat surface that is subsequently thermoformed and enclosed via injection molding.
Benefits and Challenges
Embedding electronic functionality within an enclosed part via fully additive electronics or IME offers a compelling value proposition: fewer parts, fewer connections, simpler supply chains, minimal assembly, lower weight, and improved sustainability. The ability to access these benefits with established manufacturing methods such as screen printing, thermoforming and injection molding means that IME has received extensive interest from OEMs across multiple sectors and from materials suppliers. But is there a downside to embedding electronic functionality? After all, functional foil bonding, a competing approach to IME with less integration that also enables backlit touch-sensitive interfaces, has gained considerable commercial traction and is deployed in multiple vehicles today.
Arguably the main challenge for embedded electronics methods such as IME is that the product of individual yields determines the overall production yield. As such, the yield of each constituent process, including those that are purely decorative, must be extremely high – if there is a problem with any process step, the entire part must be discarded. IDTechEx has been told that the biggest yield concerns for functional surfaces are associated with producing a glossy black decorative exterior rather than the electronics themselves.
The second challenge associated with integrating electronic functionality is reconfiguring supply chains. If the separate components are assembled, then each part and hence supplier can be changed independently. In contrast, if all the components are integrated within a single part via IME or fully additive electronics, then mutual compatibility must be ensured, reducing the ease of switching suppliers and potentially increasing component prices.
When Is Functionality Integration Worthwhile?
Determining when the functionality integration offered by IME is most compelling requires consideration of two parameters: degree of integration and production volume. Achieving the requisite high yields and reconfiguring the supply chain imposes high initial costs but can reduce variable costs since less material is used and less assembly is required. Furthermore, greater integration, such as embedding integrated circuits (ICs) within IME parts to provide processing capability, further reduces material and assembly costs.
As such, IDTechEx suggests that embedded electronics, either IME or fully additive, will have a higher value proposition as both production volume and the extent of functionality integration increase.
Additional Information
IDTechEx’s reports “3D Electronics/Additive Electronics 2022-2032” and “In-mold Electronics 2023-2033” provide comprehensive insight into these emerging manufacturing methodologies. Drawing on interviews with companies and conference visits, both reports evaluate the competing technical processes, material requirements and applications. Each report includes 10-year market forecasts segmented by technology and application sector, expressed as both revenue and area/volume.
