SILICON VALLEY, CA – Zero Defects International [ZDI] has announced their participation as an exhibitor at the SMTA Rocky Mountain Expo and Tech Forum. It will be held at the Sheraton Denver Downtown Hotel. The date of this event is Wednesday, March 15. The address of the Sheraton is 1550 Court Place, Denver, Colorado.
Foremost among the PCBA test and inspection products to be shown will be Viscom's AOI, X-Ray and SPI inspection equipment. The Viscom display will include updates on the very latest enhancements for each of these products. Also, ZDI will have information on their flying-probe test services as well as reverse engineering and failure analysis services. Those in attendance include Michaela Brody, President and Paul Benke, CEO as well as Viscom sales management personnel, Barbara Koczera and Ed Moll. Other ZDI partners, for which information will be available, include Europlacer, Velan, Tagarno, Epoch International, and Arcadia.
SANTA ANA, CA – Matrix Electronics and Advanced Engineering (AE) are pleased to announce the availability of a new generation of automated robot handling and peeler systems for the Printed Circuit Board and Integrated Circuit Substrate manufacturing industries.
Advanced Engineering continues to impress the PCB industry with their inventive PCB and now IC Substrate automation solutions. Offering a complete automation equipment and software solution from their specialized shop in Hallein, Austria, the AE engineering teams are focused on accelerating production for their customers with consistency and accuracy.
“We are impressed with the willingness of North American PCB manufacturers to adopt and ramp up automation in their plants. The PCB industry is strong in North America and Matrix is looking for innovative ways to support the growth of our customers,” says Kieran Healy, President of Matrix Electronics. “New equipment designs from Advanced Engineering including the MOJO, Servant, and Peeler devices take PCB manufacturing to the next level for our customers. This advanced automation approach to PCB manufacturing reduced costs, ensures consistency and quality while optimizing plant capacity.”
Advanced Engineering harnesses the latest software and component technology from well-known manufacturers such as BECKHOFF, SICK, KEYENCE, PILZ and FESTO. All machines link directly to an MES or ERP system, giving customers superior data collection and reporting. The intelligence gathered from these systems is fed back into process engineering to optimize productivity and efficiency of the line.
SANTA ANA, CA – TTM Technologies, Inc. (“TTM,” NASDAQ: TTMI), a leading global manufacturer of technology solutions including engineered systems, radio frequency (“RF”) components and RF microwave/microelectronic assemblies, and printed circuit boards (“PCB”), announced today that pending confirmation by the Defense Counterintelligence and Security Agency (“DCSA”), the TTM Board of Directors has adopted a Special Board Resolution (“SBR”), replacing the Special Security Agreement (“SSA”) that the Company had entered into with the DCSA in 2010. The replacement of the SSA with the SBR is a result of the significantly reduced foreign ownership of TTM. The effective date of the SBR is February 2nd, 2023.
“Since the SSA was established in 2010, there has been a significant reduction in the foreign ownership of TTM’s public shares and our one non U.S. citizen Board member has retired,” said Rex Geveden, Chairman of the Board of TTM. “As a result, the DCSA has agreed to replace the SSA with the SBR. The company plans to maintain much of the robust infrastructure developed during the adoption of and compliance with the SSA to continue to serve our customers and to maintain our focus on the national security of the United States in our Aerospace and Defense Sector, as one of the top forty U.S. based defense companies,” concluded Mr. Geveden.
The SBR Agreement with DCSA codifies the standing Government Security Committee of TTM’s Board of Directors, consisting of at least 3 Board members that hold a National Security Clearance. In addition, the SBR dictates that TTM will maintain its policies and procedures that have been established pursuant to the provisions of the SSA to mitigate risks to TTM’s operations that serve the national security of the United States, including the maintenance of its cybersecurity plan that meets the requirements of NIST 800-171. DCSA will continue to review TTM’s compliance with the terms of the SBR annually at each of TTM’s sites which operate under a U.S. Department of Defense security clearance. This change acknowledges that TTM no longer has any significant foreign owners of its equity. In addition, all of TTM’s Board is currently comprised of U.S. citizens and per the terms of the SBR, no foreign citizen is allowed to sit on TTM’s Board in the future.
TTM expects the replacement of the SSA with the SBR to have no material impact on the company’s cost structure.
WALTHAM, MA – Nano Dimension Ltd. (Nasdaq: NNDM, “Nano Dimension” or the “Company”), a leading supplier of Additively Manufactured Electronics (“AME”) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (“AM”) 3D printers, announced today that it has received a purchase order from a supplier to the U.S. government defense industry, for a DragonFly IV®, the leading Additive Manufacturing Electronics (AME) 3D-printer.
The customer is a supplier to the U.S. government defense community, in particular the intelligence ecosystem, enabling innovation for the next generation battlespace. It leverages solutions designed to support the rapidly evolving technological environment. This customer, like many others, sees the DragonFly IV® as a critical means to advance innovation in a way that other technologies of electronics manufacturing cannot achieve.
The DragonFly IV® system and specialized materials serve cross-industry High-Performance-Electronic-Devices (Hi-PEDs®) fabrication needs by simultaneously depositing proprietary conductive and dielectric substances, while integrating in-situ capacitors, antennas, coils, transformers, and electromechanical components. The outcomes are Hi-PEDs® which are critical enablers of autonomous intelligent drones, cars, satellites, smartphones, and in vivo medical devices. In addition, these products enable iterative development, IP safety, fast time-to-market, and device performance gains.
Yoav Stern, Chairman and Chief Executive Officer of Nano Dimension, stated: “Many of us, almost all of Nano Dimension’s management and a majority of our employees, have had prolonged and intense periods of our lives serving our countries in the defense forces, be it Air Force, Special Forces, Government Intelligence Agencies and others. As such, we are proud to be able to supply a unique group like this customer with technologies that will help fulfil national missions while hopefully reducing risks and saving people’s lives. It is an honor for us to be a business partner of such people, missions, and efforts.”
SCHWETZINGEN, GERMANY – Industrial inkjet printing developer Notion Systems announced that is has been selected by the Institute of Chemistry, Chinese Academy of Sciences (ICASS) for organic material R&D. Notion Systems worked together with its partner YixinTech as its system went through a long comparison against other inkjet printers in the market.
ICCAS is a multi-disciplinary research institute dedicated to basic research in broad fields of chemical sciences. One of its major research areas is organic materials for display applications.
Antonio Schmidt, SVP at Notion Systems, said: "We thank the ICCAS team for their trust and are convinced that our industrial inkjet solutions will add great value to accelerate their research and protect the environment. We are glad, that the reopening of the borders allows us a very close and extensive cooperation”.
BANNOCKBURN, IL – In recognition of their leadership and their significant contributions of time and talent to IPC and the electronics manufacturing industry, three IPC volunteers were presented with the IPC President’s Award at IPC APEX EXPO in San Diego, Calif on January 24, 2023. Recipients were Steven Bowles, Lockheed Martin; Stan Rak, SF Rak Company; and Savita Ganjigatti, Sienna ECAD Technologies Private Limited.
Steven Bowles is a member of more than 30 standards development committees, holding leadership roles as Chair of 3-10 Printed Board Base Materials, D- 13 Flexible Circuits Base Materials, D-15 Flexible Circuits Test Methods, and D-11 Flexible Circuits Design. He is the Chair Emeritus of 2-30 Terms and Definitions Committee. Bowles is also a member of the Committee Chairman’s Council and a Lifetime Member of IPC’s Technical Activities Executive Committee (TAEC). He is a member of the Lead-Free Electronics Risk Management, (PERM) Council, a Mentor in IPC’s Emerging Engineer Program, and was the very first recipient of IPC’s Rising Star Award in 2015. Winner of many committee leadership and committee service awards, Bowles also serves as an IPC standards committee A-Team leader.
Stan Rak is the chair of the IPC APEX EXPO 2023 Technical Program Committee (TPC) where he has served for six Technical Conferences in different roles, working closely with IPC staff and industry experts on program development. Developments include the expansion and strengthening of the TPC, the introduction of Special Sessions designed to stimulate audience participation in emerging fields and assisting with the transition to a digital document format for improved communications with authors. Rak has contributed to the inaugural releases of the standards, IPC-5262, IPC J-STD-001GA/IPC-A-610GA, and IPC-7093. He received the IPC Rising Star Award in 2016 for IPC-related contributions to the automotive electronics manufacturing industry.
Savita Ganjigatti has been involved in the industry for more than 30 years, and served as a steering committee member for the IPC 2022 Global Design Competition, representing the Asia Pacific region. A program panel member of the IPC Global Thought Leadership Program, she has also serves on the IPC India Technical Advisory Committee, was instrumental in starting the PCB competition in that region, and conducted many design contests. Ganjigatti was a critical in the development of the Women in India Electronics group, paper presentations, and standards reviews facilitated by IPC India. She helped to implement “PCB Design Engineering” as an elective at several Indian universities, and she is actively involved in skill development initiatives of the Indian central government.
“The leadership and expertise of Steven, Stan, and Savita sets the standard for building electronics better,” said John W. Mitchell, IPC president and CEO. “By presenting them with IPC President’s Awards, we are showing our appreciation for their significant contributions to IPC and the global electronics manufacturing industry.”