WEST CHICAGO, IL – PCB fabricator American Standard Circuits has recently purchased and installed a new Burkle LAMV 125 thermal oil heated lamination press.
This state-of-the-art solution from Burkle incorporates the latest technology. Details of the thermal oil heated press, type LAMV include:
Press range: 20 tons – 2000 tons
Hydraulically operated
Thermal oil heated and cooled
Vacuum available
Operating temperatures up to 385° C
Platen size up to 1.400 x 2.350 m.
“This new press will give us the layer-to-layer registration and lamination thickness that we need as we continue to raise our level of technology. This will also prove beneficial when it comes to tighter registration as well as drilling accuracy for both location and depth-controlled drilling,” commented ASC President and CEO Anaya Vardya.
ROME, NY – The EOS/ESD Association, Inc. (ESDA) announces the release of ESD and Latch-up Challenges – An Outlook until 2030, a white paper focused on four essential areas to enable the technical advances of the coming years. EOS/ESD Association, Inc. provides a vision and roadmap for research and development (R&D) and education in the field of ESD and latch-up. The document guides academic institutions and research centers toward the relevant topics in ESD and latch-up. The white paper further provides a framework and the background for successful applications for R&D funding by academic institutions. Each topic is introduced together with the individual research challenges that need to be solved in the coming years to advance the knowledge in ESD and latch-up.
The European Union (EU) commission and the United States (US) government are stimulating their home-grown semiconductor manufacturing capabilities and capacities. For this effort, they strongly support the expansion of European and American semiconductor manufacturing, including constructing new semiconductor production facilities in the EU member countries and the US.
The White Paper identifies research challenges, provides an industry outlook, and establishes collaborations across industry and academia in the field of electrostatic discharge (ESD) and latch-up. In support of digitalization and decarbonization in a transforming worldwide economy, the white paper addresses essential areas necessary for these critical technical advances.
Executive Director Lisa Pimpinella of EOS/ESD Association, Inc. said, “The EOS/ESD Association, Inc. is the independent association with the technical expertise to provide the roadmap for research and development (R&D) and education in electrostatic discharge (ESD) and latch-up. We support academia in their funding efforts as they define proposals addressing the topics named in this White Paper. As an association that combines representatives from all of the major semiconductor companies in the world, we want to highlight the criticality of research, development, education, and funding to ensure electrostatic discharge is recognized and the major thrust behind reliability.”
The White Paper consists of four focus areas essential for technological advances of the future. Advances in CMOS technologies, applications of new materials such as III/V compound semiconductors, Electrical Design Automation (EDA), and an outlook on challenges in ESD manufacturing control and testing.
EOS/ESD Association, Inc., founded and located in Rome, NY, in 1982, focuses on providing electrostatic discharge awareness, education, controls, and prevention.
FOUNTAIN INN, SC – KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, is proud to announce that its MIL-PRF-32535 BME NP0 MLCCs have been approved to the Defense Logistics Agency (DLA) Qualified Products Database (QPD).
The new MIL-PRF-32535 BME NP0 MLCCs have higher CV capabilities than standard surface-mount PME MLCCs qualified to military and aerospace specifications and are currently available in “M” and “T” reliability levels and 0402, 0603, and 0805 case sizes and rated for 68–1,500pF and 4–100V. These small, high-CV MLCCs enable revolutionary board space, weight, and component count reductions. They also feature KYOCERA AVX’s patented FLEXITERM® termination technology, which, compared to standard terminations, significantly enhances resistance to the thermomechanical stresses experienced during assembly and operation.
MIL-PRF-32535 BME NP0 MLCCs are approved for use in high-reliability military and aerospace applications including filtering, tuning, decoupling, timing, and blocking circuits.
“We have been honing and perfecting best-in-class BME MLCC technology since the 1990s and are proud to further extend our portfolio of tested and proven high-CV solutions qualified for use in high-reliability military and aerospace applications,” said Michael Conway, Product & Marketing Manager – High-Reliability Components, KYOCERA AVX. “The new MIL-PRF-32535 BME NP0 series is the latest development in our enduring mission to meet our high-rel customers’ needs. It satisfies a growing demand for smaller, high-CV, military-qualified capacitor technology, and we will continue to expand this product range and this portfolio to meet the ever-evolving demands of the global military and aerospace industry.”
Lead time for the series is currently 22 weeks for M-level reliability parts (Group A) and 38 weeks for T-level reliability parts (Groups A and B). However, lead times could be shorter if the parts are in stock at an authorized distributor, such as Avnet, Arrow, and TTI.
For prototype and verification designs, KYOCERA AVX recommends the use of its Engineering Module (EM) Range X7R BME MLCCs for non-flight prototypes. This series covers capacitors in the ESCC 3009041, NASA S311-P838, and MIL 32535 ranges and uses the same materials as the fully qualified part numbers, just without the final DLA and European Space Components Coordination (ESCC) testing and screening processes and QPD/QPL listings, so it’s available with shorter lead times.
WALTHAM, MA – Nano Dimension Ltd. (Nasdaq: NNDM, “Nano Dimension” or the “Company”), a leading supplier of Additively Manufactured Electronics (“AME”) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (“AM”) 3D printers, announced today that the notice of special general meeting of the Company’s shareholders issued by Murchinson Ltd. (“Murchinson”) on February 13th, 2023 (the “Illegal Notice”) failed to comply with core requirements under applicable law and thus was made without any underlying legal right to do so. Accordingly, the Illegal Notice will be disregarded by the Company.
Shareholders are warned: Do not follow the instructions made in Bistricer’s Murchinson’s Illegal Notice. As previously announced on January 30th, 2023, the demand by Murchinson and Mark Bistricer to call a special shareholders meeting was rejected due to the failure of Murchison to comply with the requirements set forth under the Israeli Companies Law for calling such a meeting. Similarly, the Illegal Notice is not compliant with the Israeli Companies Law and should be disregarded by shareholders.
Only The Company will inform its shareholders if and when a valid meeting will be held.
Bistricer’s Murchinson has a repetitive record of stock manipulations and violations of law, and legal proceedings with regulatory authorities: Mr. Bistricer was accused, this month, of unjust enrichment to Mr. Bistricer’s Saline...the retail investors never knew… [they] were deprived of their rights.
Given the above, the Board of Directors of Nano Dimension (the “Board”) is committed to carefully examine any demand made by shady Bistricer’s Murchinson as well as their conduct surrounding the Company in order to protect the rights of all of Nano Dimension’s shareholders and for the benefit of the Company.
The Board is acting, and will continue to act, to upkeep the adequate corporate governance in the Company, in accordance with the applicable laws and regulations in Israel and the United States as well as with the Company’s articles of association in order to protect the company and its shareholders’ rights.
ELGIN, IL – I am proud to announce that client Brigitflex has upgraded their QMS from ISO 9001: 2015 and received certification to AS9100D: 2016 from certifying body TUV Rheinland. Brigitte Lawrence and her management team were highly engaged with the goal of driving organizational improvement during this transition. A special shout-out to Plant Manager Bruce Gunter for his hard work and dedication throughout this project.
President & Founder Brigitte Lawrence stated:
“We have a number of Aerospace contracts in the queue, pending this certification and it was crucial to gain AS9100 certification as quickly as possible. Aside from the certification itself, I was very pleased to see the improvement in all of our business processes given the extreme complexity of our product. I would also like to acknowledge the guidance and facilitation of Steve Williams of TRAC, which was key to our success in this transition”
WALTHAM, MA – Nano Dimension Ltd. (Nasdaq: NNDM, “Nano Dimension” or the “Company”), a leading supplier of Additively Manufactured Electronics (“AME”) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (“AM”) 3D printers, announced today it has been granted a patent the area of artificial intelligence (AI), and more specifically relating to the neural network that supports its cloud-based manufacturing platform.
The granted patent relates to “Cluster-Connected Neural Network.” It includes an extensive list of claims involving training and deployment of neural networks. This patent and the technology around it allow DeepCube AI solutions to run more effectively on a distributed network of 3D printers deployed throughout the world. This model for manufacturing is ever more critical as the manufacturing enabled by Nano Dimension will be more and more decentralized; thus, the technology has to run effectively wherever it may be.
This patent adds to an existing library under DeepCube, which now has 20 granted and 25 filed pending. Nano Dimension as a whole has over 81 granted and 194 filed pending.
DeepCube develops the AI/Deep Learning engine for Nano Dimension’s Additive Manufacturing printers for metal, ceramic, and electronics. DeepCube’s pioneering software inference accelerator drastically improves performance on additive manufacturing hardware.
DeepCube applies the same neutral network training behind photo and speech recognition advancements to the manufacturing of parts. Multiple sensors can spot defects too small for the human eye and improve part quality. Additionally, AI-driven decision making corrects printing errors in real time and increase manufacturing yield and throughput.
DeepCube’s propriety algorithms increase the speeds of data analysis tenfold, making it the only hardware performance accelerator of its kind. Memory usage reduction is achieved by overcoming the infrastructure, energy, and memory limitations of previous AI models for low-cost deployment.
DeepCube transforms 3D printers into a viable global solution for the demands of Industry 4.0. This is a core part of the Company’s strategy, as evident by the acquisition of DeepCube in April 2021. These patents are a leading example of how deep learning-based AI is laying the foundation for the Company in developing leading additive manufacturing solutions.
Yoav Stern, Chairman and Chief Executive Officer of Nano Dimension, shared: “When we acquired DeepCube, it was under the premise that 3D printing, or additive manufacturing, was ripe for disruption with AI. With this in mind, we have and continue to see deep learning-based AI as a key to driving the throughput and yield improvements that will take our advanced manufacturing solutions to the next level. These patents, and the others like them, are clear examples of the hard work that is coming to fruition. It is difficult to imagine these achievements without the Deep Learning dedicated leaders we have in our DeepCube Group. Our customers are noticing the difference that these technologies enable.”
