MILPITAS, CA – Global semiconductor materials market revenue grew 8.9% to $72.7 billion in 2022, surpassing the previous market high of $66.8 billion set in 2021, SEMI, the global industry association representing the electronics manufacturing and design supply chain, reported today in its Materials Market Data Subscription (MMDS).
Wafer fabrication materials and packaging materials revenue in 2022 reached $44.7 billion and $28.0 billion, respectively, increasing 10.5% and 6.3%. The silicon, electronic gases, and photomask segments showed the strongest growth in the wafer fabrication materials market, while the organic substrates segment largely drove packaging materials market growth.
For the 13th consecutive year, Taiwan, at $20.1 billion, was the world's largest consumer of semiconductor materials on the strength of its foundry capacity and advanced packaging base. China continued to register strong year-over-year results, ranking second in 2022, while Korea finished as the third largest consumer of semiconductor materials. Most regions registered high single- or double-digit growth last year.
Note: Summed subtotals may not equal the total due to rounding. * Rest of World includes Singapore, Malaysia, Philippines, other areas of Southeast Asia and smaller global markets. ** 2021 data reflects current updates.
The Materials Market Data Subscription (MMDS) from SEMI provides annual revenue with 10 years of historical data and a two-year forecast. The annual subscription includes quarterly updates for the materials segment and reports revenue for seven market regions (North America, Europe, Japan, Taiwan, South Korea, China and Rest of World). The report also features detailed historical data for silicon shipments and revenues for photoresist, photoresist ancillaries, process gases and lead frames.
For more information about the report or to subscribe, please contact the SEMI Market Intelligence Team at This email address is being protected from spambots. You need JavaScript enabled to view it.. More details are also available on the SEMI Market Data webpage.
MILPITAS, CA – Global 300mm fab equipment spending for front-end facilities next year is expected to begin a growth streak to a US$119 billion record high in 2026 following a decline in 2023, SEMI highlighted today in its quarterly 300mm Fab Outlook Report to 2026. Strong demand for high-performance computing, automotive applications and improved demand for memory will fuel double-digit spending in equipment investments over the three-year period.
After the projected 18% drop to US$74 billion this year, global 300mm fab equipment spending is forecast to rise 12% to $US82 billion in 2024, 24% to US$101.9 billion in 2025 and 17% to US$118.8 billion in 2026.
“The projected equipment spending growth wave underscores the strong secular demand for semiconductors,” said Ajit Manocha, SEMI President and CEO. “The foundry and memory sectors will figure prominently in this expansion, pointing to demand for chips across a wide breadth of end markets and applications.”
Regional Growth
Korea is expected to lead global 300mm fab equipment spending in 2026 with US$30.2 billion in investments, nearly doubling from US$15.7 billion in 2023. Taiwan is forecast to invest US$23.8 billion in 2026, up from US$22.4 billion this year, and China is projected to log US$16.1 billion in spending in 2026, an increase from US$14.9 billion in 2023. Americas equipment spending is expected to nearly double from US$9.6 billion this year to US$18.8 billion in 2026.
Segment Growth
Foundry is projected to lead other segments in equipment spending at US$62.1 billion in 2026, an increase from US$44.6 billion in 2023, followed by memory at US$42.9 billion, a 170% increase from 2023. Analog spending is forecast to increase from US$5 billion this year to US$6.2 billion in 2026. The microprocessor/microcontroller, discrete (mainly power devices), and optoelectronics segments are expected to see spending declines in 2026, while investments in logic is forecast to rise.
The SEMI 300mm Fab Outlook Report To 2026 report lists 369 facilities and lines globally, including 53 high-probability facilities expected to start operation during the four years starting in 2023.
LEUVEN, BELGIUM – At this week’s International Microwave Symposium, imec – a world-leading research and innovation hub in nanoelectronics and digital technologies, and AT&S – a leading manufacturer of high-end printed circuit boards (PCBs) and IC substrates, present a major step towards realizing a novel system integration approach, whereby D-Band chips and waveguides are integrated into low-cost, mass-manufacturable PCBs. This new approach paves the way for the development of compact, cost-effective, and high-performance 140 GHz (automotive) radar and 6G mobile communications systems, offering significantly lower signal loss in comparison to planar PCB lines or substrate-integrated waveguides (SIWs) in PCBs and interposers.
The need for higher bandwidths in applications such as automotive radar and upcoming 6G mobile networks is fueling the demand for higher radio frequencies. This is why the D-Band, spanning from 110 to 170 GHz, garners significant attention.
But tapping into these frequencies poses challenges, such as increased system complexity and signal attenuation. Hollow air-filled substrate-integrated waveguide (AFSIW) technology with fully metalized sidewalls offers significantly reduced signal loss compared to substrate-integrated waveguides (SIWs) that use rows of vias and the planar interconnect technology used in current communication and radar systems. Despite this intrinsic benefit, a mass-production approach for PCBs with integrated AFSIW waveguides is currently unavailable.
The world's first implementation of D-Band AFSIWs in a low-cost, mass-manufacturable PCB – coming with a five-fold loss reduction
“To facilitate the next generation of cost-effective, high-performance radar and communication systems, millimeter-wave front-end systems that can operate at frequencies exceeding 100 GHz are necessary. However, a key concern is how these antennas and millimeter-wave ICs can be optimally connected. We believe a key part of the solution is to utilize AFSIW technology. Unfortunately, such waveguides are expensive and hard to integrate into multi-layer PCBs or interposers. Imec and AT&S have partnered to address this challenge. Together we demonstrate an integrated front-end combining imec’s 140 GHz radar ICs in combination with a novel packaging/module concept developed by AT&S. The demonstration of PCB-integrated AFSIWs is an important breakthrough towards achieving this end goal,” said Ilja Ocket, program manager at imec.
As part of an advanced system module concept, AT&S and imec have collaborated to develop D-Band AFSIWs with solid copper sidewalls integrated into a multi-layer PCB to prevent signal leakage and to form arbitrarily shaped air cavities. It is the first successful demonstration of an AFSIW operating above 100 GHz, and integrated into a low-cost, mass-manufacturable PCB. By eliminating dielectric losses, so that only conductor losses remain, the new approach achieves a loss of 0.07 to 0.08dB/mm across the 115 to 155 GHz frequency range, translating into a five-fold reduction compared to reported planar PCB lines or SIWs in PCBs and interposers. These impressive results only represent a first step, as further improvements will continue to drive down losses even further in the coming years.
From enhanced awareness in automotive to 6G networks
“Imec’s 140 GHz radar chips and packaging design expertise have given us a significant head start. We believe that our new packaging approach can be utilized to create efficient, compact, and high-resolution 140 GHz radar modules for automotive applications, creating vehicles that are increasingly ‘aware’ of what is happening, both in-cabin and around them,” said Erich Schlaffer, program manager R&D Electronics Solution at AT&S. “Additionally, this technology will find its way in 6G mobile networks.”
MILWAUKEE, WI – RBP Chemical Technology, a renowned supplier of specialty chemicals and delivery devices for the pressroom, printed circuit board (PCB) fabrication, and medical implant device industries, is excited to announce its strategic partnership with Mid-States Graphics, a trusted provider of cutting-edge solutions for professional printers since 1984.
This partnership marks a significant milestone for both RBP Chemical Technology and Mid-States Graphics as they join forces to enhance their product offerings and deliver unparalleled customer service to the graphic arts industry. With Mid-States Graphics’ extensive expertise and RBP’s top-of-the-line chemicals, customers can expect a comprehensive range of high-quality pressroom products designed to meet the evolving demands of today’s professional printers.
“We are thrilled to partner with Mid-States Graphics,” said Ken Kocolowski, National Sales Manager for Print, at RBP Chemical Technology. “Their proven track record of delivering innovative solutions aligns perfectly with our commitment to excellence. Together, we are confident in our ability to provide unmatched value and support to our customers in the graphic arts industry.”
Mid-States Graphics has built a reputation for its commitment to customer satisfaction and its ability to address the unique challenges faced by professional printers. By leveraging RBP Chemical Technology’s cutting-edge products and extensive industry knowledge, Mid-States Graphics will strengthen its ability to deliver tailored solutions to its customers.
“We are excited to join forces with RBP Chemical Technology,” stated John Miller, President at Mid-States Graphics. “This partnership allows us to expand our product portfolio and offer our customers a wider range of pressroom products that meet their specific needs. We look forward to leveraging RBP’s industry expertise and providing our customers with even greater value.”
Customers can expect a seamless transition as RBP Chemical Technology takes on some of the distribution of Mid-States Graphics Pressroom products. The partnership aims to improve accessibility to these high-quality products, streamline order fulfillment processes, and enhance overall customer experience.
WALTHAM, MA – Nano Dimension Ltd. (Nasdaq: NNDM) (“Nano Dimension”, “Nano” or the “Company”), a leading supplier of Additively Manufactured Electronics (“AME”) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (“AM”) 3D printers, today reinforced its plan to deliver long-term value to Stratasys Ltd. (Nasdaq: SSYS) (“Stratasys”) shareholders, which includes:
An $18.00 per share special tender offer to provide certain, near-term premium and all-cash value to Stratasys shareholders.
Nano demands that the Stratasys Board call an Extraordinary General Meeting of Stratasys shareholders following the completion of the $18-per-share-special-tender for the purpose of removing the majority of the Stratasys Board of Directors and replacing them with highly qualified nominees proposed by Nano. Nano believes such action is vital to prevent further value destruction and create a path to establishing a preeminent leader in the rapidly growing AM market that will drive long-term value.
Nano Dimension is offering a straightforward plan to deliver value:
Delivers IMMEDIATE $18 cash value to Stratasys shareholders.
Nano leadership will set up management to be committed, motivated and compensated based on demonstrating efficacy in driving the performance of Stratasys, which will become the main business asset of Nano following the successful tender, reversing years of lagging Stratasys growth and profits. The immediate value of Nano’s $18 per share all-cash tender is clear:
Provides a premium to all relevant Stratasys historical trading levels, including a 39% premium to the unaffected 60-day VWAP as of March 3rd, 2023.
Provides more certainty than the pending Desktop Metal Ltd. (NYSE: DM) (“Desktop Metal”) merger agreement or the 3D Systems Corp. (NYSE: DDD) (“3D Systems”) unsolicited, unclear & dubious proposal.
Nano has approximately $1 billion in cash and cash equivalents on hand to complete the special tender offer, which is not subject to Nano shareholder approval. The board of directors of Nano has full authority to effect the tender offer as confirmed by the Israeli courts. Nano believes urgent change is needed. Stratasys’ current Board of Directors is not fulfilling its fiduciary duties and not acting in its shareholders’ interests:
Stratasys directors refused to negotiate with Nano, a well-funded and reputable peer that made multiple all-cash offers at compelling premia, disregarding Nano’s efforts to reach a mutually agreeable all-cash acquisition of all outstanding ordinary shares of Stratasys not currently owned by Nano. Those offers included:
$18.00, $19.55, and $20.05 per share, reflecting premiums of 26%, 37% and 41% to the unaffected closing stock price as of March 3rd, 2023, submitted to Stratasys on March 22nd, 29th and April 3rd, 2023, respectively.
Stratasys directors (several of which are ex-CEOs of the company) and management have a history of empty promises to Stratasys shareholders, including making statements every two to three years that Stratasys will become a “billion-dollar company,” only to deliver further cash burn and value destruction, as evidenced by the losses on the sale of MakerBot in September 2022. MakerBot alone cost its shareholders at least $403 million (for a startup with approximately $15.7 million revenue in the year prior to acquisition) and additional over $60 million in cash1 which was spent in order to sell/spin out a failed investment. This was originally initiated and closed by a present board member when he was the CEO of Stratasys. This is just one of many examples of the Stratasys Board’s history of value destruction.
Stratasys directors agreed to a value-destroying transaction with Desktop Metal designed to preserve their entrenchment. Stratasys’ agreement to merge with a cash-burning de-SPAC in a transaction would destroy value and be highly dilutive to Stratasys shareholders, leaving shareholders with less than two-thirds of a company that would have an uncertain path for long-term value creation.
Over the last few days, Stratasys’ institutional and other shareholders have already filed lawsuits against this Board about their corporate governance practices in relation to the transaction.
Stratasys needs better management, operators and, first and foremost, Board oversight to optimize the business and set the company on a path to realize its potential.
The time for change at Stratasys is now. Through its SPECIAL TENDER OFFER of June 26th, 2023, and the ultimate replacement of the Stratasys Board, Nano Dimension will provide that change and allow Stratasys shareholders to realize the potential of their investment.
CAMBRIDGE, UK – What do electronic skin patches, thin-film flexible photovoltaics and automotive interior consoles have in common? All are produced using printed & flexible electronics, an alternative approach to conventional printed circuit boards that combines additive manufacturing with flexible substrates. Bringing benefits such as rapid prototyping, improved sustainability, scope for form factor differentiation and even stretchability, printed & flexible electronics is gaining traction across an extremely diverse range of applications.
IDTechEx's new report "Flexible & Printed Electronics 2023-2033: Forecasts, Technologies, Markets" provides a comprehensive overview of what can seem a bewilderingly broad topic. By summarizing IDTechEx's extensive printed/flexible electronics report portfolio and drawing on years of following this developing industry, the report outlines innovations, opportunities, and trends across 5 sectors of the printed and flexible electronics market: automotive, consumer goods, energy, healthcare/wellness, and infrastructure/buildings/industrial. This analysis includes granular forecasts of 50 distinct applications and 40 detailed company profiles.
Additionally, the report outlines developments across multiple underlying technologies: 6 distinct manufacturing modalities (including in-mold electronics and flexible hybrid electronics), 5 material types (including conductive inks and component attachment materials), and 4 component types (including flexible ICs). Multiple recent examples, acquired from interviews and industry conferences, show technology development directions and successful commercialization. Assessments of technological and commercial readiness, along with additional forecasts for manufacturing methods and conductive inks, are also included.
Application Opportunities
As with conventional PCBs, printed & flexible electronics has applications across most market verticals. For example, electronic skin patches utilizing conductive inks for electrodes and contacts are already available, as are printed pressure-sensitive insoles for gait monitoring. Conformality lends itself to automotive interiors, where printed/flexible electronics is utilized for lighting, heating and touch-sensitive interfaces. Organic photovoltaics is seeing a renaissance, with recent commercial examples including both building integration and indoor energy harvesting. Sensors based on printed electronics for asset tracking and preventative maintenance promise low production costs novel form factors to suit specific requirements.
Innovations
Printed & flexible electronics represents a fundamentally different approach to manufacturing, replacing subtractive removal of laminated copper with additive deposition of conductive ink. This reduces waste and facilitates digital manufacturing with the associated benefits of rapid prototyping and straightforward design adjustments. The report evaluates a range of manufacturing innovations and their prospects, ranging from fully additive 3D electronics to in-mold electronics and emerging digital printing methods with resolutions as small as 1 μm.
Material innovations underpin many emerging hardware technologies, and printed electronics is no exception. Conductive inks underpin the technology, with dozens of companies developing inks with a range of compositions and attributes. Viscous silver-flake-based ink for screen printing dominates, but alternatives such as nano-particle and particle-free inks are gaining traction for specific applications such as EMI shielding. An especially notable trend is the development of copper ink, which promises a substantial cost reduction over its silver counterparts. Other specialized materials include ultra-low temperature solder and field-aligned anisotropic conductive adhesives enable components such as LEDs to be securely attached to cheaper, thermally fragile substrates. Furthermore, many sensors require specialist materials, such as printable piezoelectric polymers for vibration sensing and functionalized carbon nanotubes for ion detection.
While the original vision for printed and flexible electronics was to print every aspect of the circuit, including the integrated circuit, this has largely been supplanted by flexible hybrid electronics (FHE), which combines printed and mounted functionality. As such, there is an opportunity for natively flexible integrated circuits, batteries, and displays.
Building on Expertise
IDTechEx has been researching developments in the printed and flexible electronics market for well over a decade. Since then, we have stayed close to technical and commercial developments, interviewing key players worldwide, annually attending conferences such as FLEX and LOPEC, delivering multiple consulting projects, and running classes/ workshops on the topic. "Flexible & Printed Electronics 2023-2033: Forecasts, Technologies, Markets" utilizes this experience and expertise to summarize IDTechEx's knowledge and insight across the entire field.
To find out more, including downloadable sample pages, please visit www.IDTechEx.com/PE
Upcoming Free-to-Attend Webinar Printed and Flexible Electronics: State of the Industry
An introduction to printed and flexible electronics, including motivating factors
Assessment of product-market fit across the application space, including discussion of use cases seeing most commercial traction
A selection of recent innovations spanning materials, components, and manufacturing methods
A roadmap for how the industry will develop, spanning both technologies and applications
There will be a Q&A session at the end of this webinar, where Dr Dyson will answer a few questions that have been sent in. Please send your questions to This email address is being protected from spambots. You need JavaScript enabled to view it. by Friday 7th July. Please note that there will not be time to answer all of the questions sent in.
Click here to register your place on one of our three sessions. If you are unable to make the date, please register anyway to receive the links to the on-demand recording and slides as soon as they are available!
