WALTHAM, MA – Nano Dimension Ltd. (Nasdaq: NNDM, “Nano Dimension” or the “Company”), a leading supplier of Additively Manufactured Electronics (“AME”) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (“AM”) 3D printers, are releasing videos addressing vision, plans and answering likely questions.
A longer video which unpacks the topics discussed in greater length will be released very shortly. Please refer to the Nano Dimension YouTube channel for this and all other videos: https://www.youtube.com/@NanoDimension
In these videos, Nano Dimension's Chairman and Chief Executive Officer Yoav Stern provides clear and concise vision and strategy for the combined company, clear ups any doubts, and eradicates misconceptions.
We believe that this initiative will promote transparency and reinforce our commitment to keep our shareholders well-informed, rather than repetitively exposed texts written by Mr. Bistricer assistants (i.e. Moshe Zarfati) and/or Anson Funds employees, who seem to be even more confused than their mutual or coordinated partner.
CHICAGO – West Chicago based printed circuit fabricator American Standard Circuits has attained their ISO 13485:16 medical certification. ISO 13485:2016 specifies requirements for a quality management system where an organization needs to demonstrate its ability to provide medical devices and related services that consistently meet customer and applicable regulatory requirements.
President and CEO, Anaya Vardya commented, “This certification represents a great deal of work and dedication from all our team members. They all put together a tremendous effort to reach this goal. It is my understanding that there are very few printed circuit board companies (If any in North America) that have earned ISO 13485:16 Medical Certification which makes us stand out as a preferred medical electronics circuit board provider. As we continued to grow our medical business exponentially, we felt that this certification would go a long way in establishing our leadership in this marketplace. Now that we have made the investment in time and people to accomplish this certification we look forward to meeting and working with even more medical electronics companies.”
CHANDLER, AZ – Rogers Corporation (NYSE:ROG) will exhibit at the GOMACTech 2023 conference at Town & Country in San Diego, CA (Booth #509), March 21st & 22nd , highlighting laminate and film materials for use in the advanced packaging industry, used in C4ISR applications in the Ground, Air, Sea and Space domains.
GOMACTech is a premier event focused on developments in microcircuit applications for government systems.
Some of Rogers’ products being highlighted include:
Recently introduced Radix™ 3D Printable Dielectrics family of products, is the first available material featuring a dielectric constant of 2.8 and low loss characteristics at microwave frequencies. These printable dielectric materials give radio frequency (RF) designers unprecedented design freedom in creating new components, eliminating the need to consider typical manufacturing design constraints. Radix 3D Printable Dielectrics are proprietary composite materials designed for Digital Light Processing (DLP) 3D printing, enabling a scalable, high-resolution printing process for end-use RF dielectric component manufacturing. Rogers Corporation’s first Radix 3D Printable Dielectric material has a targeted dielectric constant of 2.8 and a dissipation factor of 0.0043 at 10 GHz when cured.
MAGTREX ® 555 High Impedance Laminates: The first commercially available low loss laminate with controlled permeability and permittivity, enabling antenna designers to expand the trade-space of their antenna design, enabling design flexibility and optimization.
Rogers technical staff will be available to discuss your most demanding applications from Build-Up materials for advanced packaging solutions, Phase Array Radar solutions, high frequency magneto- dielectric materials, ablative Radome materials, and metallized-shaped/3D ADM dielectric solutions.
CAMBRIDGE, UK – Integrating multiple functionalities within a single entity promises simpler, more efficient devices without compromising capability. Smartphones are a great example, with maps, diaries, phones, cameras, games consoles, and more integrated into a single, compact device. However, the smartphone itself is arguably a masterpiece of packaging, containing many different components from different suppliers that are mounted onto a chassis.
What if, rather than assembling numerous subsidiary components and ensuring electrical connectivity, the functionality was integrated into the object itself? This is the promise of ‘3D electronics’, where the boundaries between mechanical and electrical design fade away and components have the electronic functionality embedded within them. This approach can be applied to many length scales, with electronic functionality in the form of conductive inks and components are applied onto the surface of 3D objects, termed ‘partially additive’, or incorporated internally (termed ‘fully additive’, akin to 3D printing with electronics included).
In-mold electronics (IME) is a third approach to producing embedded electronics, generally in the form of smart surfaces with integrated lighting and capacitive touch sensors. With IME, conductive inks are printed and components are optionally mounted onto a flat surface that is subsequently thermoformed and enclosed via injection molding.
Benefits and Challenges
Embedding electronic functionality within an enclosed part via fully additive electronics or IME offers a compelling value proposition: fewer parts, fewer connections, simpler supply chains, minimal assembly, lower weight, and improved sustainability. The ability to access these benefits with established manufacturing methods such as screen printing, thermoforming and injection molding means that IME has received extensive interest from OEMs across multiple sectors and from materials suppliers. But is there a downside to embedding electronic functionality? After all, functional foil bonding, a competing approach to IME with less integration that also enables backlit touch-sensitive interfaces, has gained considerable commercial traction and is deployed in multiple vehicles today.
Arguably the main challenge for embedded electronics methods such as IME is that the product of individual yields determines the overall production yield. As such, the yield of each constituent process, including those that are purely decorative, must be extremely high – if there is a problem with any process step, the entire part must be discarded. IDTechEx has been told that the biggest yield concerns for functional surfaces are associated with producing a glossy black decorative exterior rather than the electronics themselves.
The second challenge associated with integrating electronic functionality is reconfiguring supply chains. If the separate components are assembled, then each part and hence supplier can be changed independently. In contrast, if all the components are integrated within a single part via IME or fully additive electronics, then mutual compatibility must be ensured, reducing the ease of switching suppliers and potentially increasing component prices.
When Is Functionality Integration Worthwhile?
Determining when the functionality integration offered by IME is most compelling requires consideration of two parameters: degree of integration and production volume. Achieving the requisite high yields and reconfiguring the supply chain imposes high initial costs but can reduce variable costs since less material is used and less assembly is required. Furthermore, greater integration, such as embedding integrated circuits (ICs) within IME parts to provide processing capability, further reduces material and assembly costs.
As such, IDTechEx suggests that embedded electronics, either IME or fully additive, will have a higher value proposition as both production volume and the extent of functionality integration increase.
Additional Information
IDTechEx’s reports “3D Electronics/Additive Electronics 2022-2032” and “In-mold Electronics 2023-2033” provide comprehensive insight into these emerging manufacturing methodologies. Drawing on interviews with companies and conference visits, both reports evaluate the competing technical processes, material requirements and applications. Each report includes 10-year market forecasts segmented by technology and application sector, expressed as both revenue and area/volume.
AUSTIN, TX – High Density Packaging (HDP) User Group announces the Jack Fisher Technical Excellence Award to honor the memory of Jack, who passed away on January 20, 2023.
Jack served as an HDP Facilitator for more than 18 years and was a major contributor to the growth of HDP over the course of his tenure. “Jack was a printed circuit board industry icon, which was recognized by his election to the IPC Hall of Fame in 2006. His expertise and experience will be missed by members and staff alike”, said Larry Marcanti, Executive Director of HDP User Group.
The Jack Fisher Technical Excellence Award will be awarded to HDP members who best exemplify the standards set by Jack over the course of his stellar career.
WALTHAM, MA – Nano Dimension Ltd. (Nasdaq: NNDM, “Nano Dimension” or the “Company”), a leading supplier of Additively Manufactured Electronics (“AME”) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (“AM”) 3D printers, announced today that it has installed one of its 3D printing systems – the Admaflex130 – at NASA’s Marshall Space Flight Center (“Marshall”).
Marshall procured the printing system as part of a project to 3D print sodium ion batteries.
The 3D printing system that is part of Nano Dimension’s multi-product offering comes from the July 2022 acquisition of Admatec Europe B.V. The Admaflex130 is exceptional for its ability to manufacture in multiple materials, specifically ceramics and metals, while also doing so at high precision. With the benefit of its Digital Light Processing (“DLP”) based technology, the 3D printer is ideal for research & development and 24/7 digital serial production of functional parts requiring complex geometries, high resolution, fine details, and smooth surface while benefiting from excellent material properties. The system also offers users the flexibility to develop custom materials and configure all printing parameters.
Yoav Stern, Chairman and Chief Executive Officer of Nano Dimension, shared: “It is hard to imagine working with an organization that is doing more groundbreaking and literally expanding the envelop of space as NASA. We are proud they have selected the Admaflex130 from Nano Dimension. Our team took a risk in developing a system that can print in multiple materials and have open parameter settings, and they did it successfully. We trust this system will enable the pioneering leaders at NASA to fabricate innovative applications. And who knows? Maybe one day soon we’ll see one such application going to Mars.”
