WASHINGTON – The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer in response to the Commerce Department’s release of a Notice of Funding Opportunity, a procedural step that sets in motion the process for companies to apply for manufacturing grants under the CHIPS and Science Act (see summary fact sheet here).
“Today’s action marks an important step forward in the implementation of the CHIPS and Science Act, a landmark law that will boost U.S. semiconductor production and innovation for years to come. We are carefully reviewing the Commerce Department’s Notice of Funding Opportunity, which lays out the rules of the road for companies to apply for the CHIPS Act’s manufacturing grants.
“In anticipation of CHIPS grants, companies in the semiconductor ecosystem have announced dozens of new projects across America since the bill was introduced. These announced projects will total hundreds of billions of dollars in private investments and support hundreds of thousands of U.S. jobs. The CHIPS Act’s manufacturing grants—along with the new law’s substantial investments in semiconductor research—will help reinvigorate the U.S. economy and reinforce America’s national security and critical supply chains.
“As Commerce Secretary Raimondo highlighted during her remarks at Georgetown University last week, CHIPS implementation provides an historic opportunity to ‘unite behind a shared objective … and think boldly and think big.’ We stand ready to work with Secretary Raimondo and leaders in the Commerce Department’s CHIPS Office to ensure the new law is implemented effectively, efficiently, and expeditiously.”
CLEVELAND, OH – NSL Analytical Services announced today that Dr. Edward Herderick has joined the materials and analytical testing company as Vice President of Science and Technology Development. Dr. Herderick is a leading expert in additive manufacturing, advanced ceramics, and materials characterization and will be focused on expanding NSL’s market-leading testing capabilities.
A 17-year veteran in materials evaluation and development, Dr. Herderick has extensive experience testing and implementing complex manufacturing technology solutions for clients in the aerospace, power generation, transportation, healthcare, and other diversified industrial sectors. He has held leadership roles at The Ohio State University, General Electric (NYSE:GE), Ohio-based startup rp+m, and the Edison Welding Institute. Dr. Herderick is also active in the materials community having served on the Board of Directors and as a Foundation Trustee for The Minerals, Metals, & Materials Society (TMS) and on the executive committee for America Makes. Dr. Herderick earned his PhD in Materials Science and Engineering from The Ohio State University.
“Ed brings nearly two decades of material science expertise to our organization. Ed’s leadership will no doubt be a force multiplier for our clients as NSL continues supporting them with industry-leading service and testing technology,” said Ron Wesel, CEO of NSL Analytical Services.
“My passion is bringing new materials technologies to market for high consequence applications,” said Dr. Herderick. “I am thrilled to join the NSL Analytical team to further testing and qualification solutions for our customers across materials science applications, from additive to batteries to hypersonics and beyond.”
Dr. Herderick’s hiring comes as NSL, a portfolio company of May River Capital, continues to invest heavily in leading-edge materials and analytical testing capabilities. The firm recently added new LC MS-MS, stress rupture, and elevated temperature testing capabilities, with additional testing services scheduled for roll out later in 2023.
In addition to Ed’s full time role as VP of Science and Technology Development at NSL, Ed will join May River Capital’s Executive Resource Group to assist May River’s portfolio companies with opportunities and initiatives within the specialized material science and additive manufacturing categories.
WASHINGTON – U.S. Sen. Mark R. Warner (D-VA), Chairman of the Senate Select Committee on Intelligence, issued a statement after the Department of Commerce released the first Notice of Funding Opportunity (NOFO) for CHIPS Act incentives, welcoming the announcement:
“The projects that will be made possible by the CHIPS Act will strengthen our national security and create good-paying manufacturing jobs here in the United States. With limited funding available, I urge the Department of Commerce to be strategic in selecting projects in order to ensure that funding advances U.S. economic and national security objectives.”
Nearly everything that has an “on” switch – from cars to phones to washing machines to ATMs to electric toothbrushes – contains a semiconductor, but just 12 percent of these ‘chips’ are currently made in America. The CHIPS and Science Act includes $52 billion in funding championed by Sen. Warner to manufacture chips here on American soil – a move that will increase economic and national security and help America compete against countries like China for the technology of the future.
Sen. Warner, co-chair of the Senate Cybersecurity Caucus and former technology entrepreneur, has long sounded the alarm about the importance of investing in domestic semiconductor manufacturing. Sen. Warner first introduced the Creating Helpful Incentives to Produce Semiconductors (CHIPS) for America Act in June 2020 along with Sen. John Cornyn (R-TX).
AUSTIN, TX – TechSearch International’s latest analysis examines strategies for the adoption of chiplets and current products. While the market is small today in unit volume, a 103% CAGR is projected from 2022 to 2026. Challenges, including design and test, are discussed.
The report includes OSAT financials and examines economic trends impacting the industry. The North American OSAT market is examined with a focus on advanced packaging capability. Future plans for North American OSATs are discussed. The report also highlights packaging and assembly in Mexico. TechSearch International analyzes the supply and demand for build-up substrates used for flip chip BGAs. The sharp decline in the PC and other markets have lowered demand and the industry has excess capacity. Some unused capacity is being released this year and a few substrate makers are slowing capacity expansion. Substrate companies are facing price pressure, creating an unhealthy condition for the industry.
The latest Advanced Packaging Update is a 47-page report with full references and an accompanying set of more than 40 PowerPoint slides. View the report at https://www.techsearchinc.com/
MILPITAS, CA – SEMI, the industry association serving the global electronics manufacturing and design supply chain, today announced that members of its Supply Chain Management (SCM) Initiative have formed an Industry Advisory Council (IAC), a group of industry leaders that will guide the initiative in its mission to advance an agile and resilient global electronics supply chain. The Council will develop solutions to help SEMI members better withstand supply chain disruptions and make proactive decisions to protect their businesses and supplier networks.
Strategic partners DHL, McKinsey & Company, and Resilinc will work to accelerate and scale the initiative. The Council will establish 2023 priorities and deliverables and convene at least quarterly to ensure the SCM Initiative is on track to fulfill its vision.
Founding members of the SCM Industry Advisory Council:
Sanchali Bhattacharjee, Strategy and Program Office, Google
Hans Ehm, Senior Principal Supply Chain Management, Infineon
Mark Liu, Director of Technology Capability, Intel
Hans-Joachim Neumann, Head of Integrated Supply Chain Electronics, Merck KGaA, Darmstadt, Germany
S.S. Fu, Director Corporate Planning Organization, TSMC
The IAC will expand to up to 20 member companies across a diverse range of segments and geographies this year. The Council will then form regional councils and working groups to produce tangible solutions.
“Geopolitical, natural and other global electronics supply chain disruptions in recent years have made clear the time is now to better prepare for future crises,” said Bettina Weiss, Chief of Staff and Corporate Strategy at SEMI. “Industry Advisory Council founding members will immediately begin to define priorities, objectives and strategies for the SEMI Supply Chain Management Initiative that lead to actions aimed at strengthening continuity across the entire value chain and supporting semiconductor industry growth.”
“SEMI applauds these industry leaders and their commitment to ensuring that the supply chain is better prepared to seize the tremendous opportunities ahead and minimize the impact of disruptions,” Weiss said.
IAC founding members are committed to working toward the following pillars and objectives:
Engagement: Establish global and regional Industry Advisory Councils to guide priorities and bolster end-to-end electronics supply chain continuity
Collaboration: Create platforms for information exchange, education and thought leadership
Data collection: Conduct quarterly SCM pulse surveys with McKinsey & Company to remain current on industry trends and benchmark best practices
Industry alignment: Establish conventions for SCM visibility and transparency through the SEMI International Standards Program
Inclusion: Develop a SCM roadmap to 2025 and beyond for all key supply chain segments to help ensure better preparedness for future disruptions
What founding members and strategic partners have to say
Infineon – Hans Ehm, Senior Principal Supply Chain Management ”Semiconductor supply chains and supply chains containing semiconductors are global. As part of Industry Advisory Council of the SEMI Supply Chain Management Initiative, we have the ability to collectively reduce the bullwhip effect in our supply chains and mitigate future chip shortages in a sustainable way.”
Intel – Mark Liu, Director of Technology Capability “A transparent semiconductor supply chain is a vital first step towards improved resiliency to ensure our industry’s future growth. The SEMI Supply Chain Management Initiative serves as a critical platform to achieve this objective collectively and collaboratively.”
Resilinc – Bindiya Vakil, CEO and Co-founder “As a strategic partner to the SEMI Supply Chain Management Initiative, Resilinc looks forward to providing a decade’s worth of supply chain mapping and risk monitoring data to help advance the Council’s mission of creating a more agile and resilient electronics supply chain.”
For more information on the SEMI Supply Chain Management Initiative or to become a member, please contact This email address is being protected from spambots. You need JavaScript enabled to view it.
TEMPE, AZ – Benchmark Electronics, a global provider of engineering, design, and manufacturing services, has released its annual Sustainability Report outlining its progress on environmental, social and governance (ESG) initiatives, including specific achievements across the company's global presence.
