AUSTIN, TX ― Cetec ERP, a leading cloud ERP software provider, is pleased to announce that Jordan Jolly, Director of Sales and Implementation, will co-host a webinar with Zuken Americas entitled, “Connecting CAD Engineering to Your ERP System.” The webinar is scheduled to take place Wednesday, Jan. 18, 2023 at 2 p.m. EST. To register for the webinar, visit https://pages.zuken.com/webinar-connecting-cad- engineering-to-your-erp-system.html
One of the joint pain points of manufacturing is being able to centralize data for multiple departments –particularly moving a BOM from an engineering CAD program such as Zuken's Harness Builder for E3.series into the ERP system for quoting, scheduling, procurement, inventory management and production. This slows down quote turnaround, causes multiple systems to have to be maintained, compromises traceability and reduces production visibility.
This webinar will cover pushing a BOM from Harness Builder for E3.series into Cetec ERP with the ability to trigger the production process with a push of a button.
Jolly helps oversee sales, marketing, product management, implementation and customer service. He has more than 10 years of experience in ERP, dealing specifically with manufacturing companies.
Cetec ERP’s leading-edge system helps customers handle stringent regulatory requirements and track dynamic production environments, all from a single, friendly web interface. All modules, support, maintenance and upgrades are included in the monthly subscription. To learn more about Cetec ERP, visit http://cetecerp.com/
CHANDLER, AZ — Isola Group, one of the world’s leading developers and suppliers of copper-clad laminates and prepreg materials for printed circuit boards (PCBs), will be inviting visitors to the 2023 IPC APEX EXPO to learn more about its low-loss circuit materials. Isola’s material experts will offer guidance on its latest halogen-free TerraGreen® 400G series of circuit materials for halogen-free PCBs. The 2023 APEX EXPO Conference & Exhibition is scheduled for January 24-26, 2023 in the San Diego Convention Center (San Diego, CA) with additional 2023 APEX EXPO meetings set for January 21-26, 2023 in the same locale.
Visitors to Booth 127 of the 2023 IPC APEX EXPO can learn more about designing and manufacturing high-frequency RF/microwave and high-speed digital circuits in excess of 100 Gb/s using environmentally sound, halogen-free TerraGreen® series of circuit material solutions, including TerraGreen® 400G, TerraGreen® 400GE, and TerraGreen® 400G2 circuit materials. The circuit materials represent low-loss advancements of the company’s popular TerraGreen® and high-frequency TerraGreen® (RF/MW) halogen-free materials. All are RoHS-compliant for use with lead-free circuit manufacturing processes and compatible with FR-4 circuit material manufacturing processes for creation of cost-effective, hybrid, multilayer circuits. The three new materials are characterized by glass transition temperature (T g ) of +200°C and decomposition temperature (T d ) of +380°C.
Sean Mirshafiei, Isola Group’s Chief Sales and Marketing Officer, notes: “We are very excited to offer the PCB industry our three new products that were created with a unique halogen-free resin system that has outstanding CAF and bond line resistance.” He added: “TerraGreen® 400G2 is our most advanced High Speed Digital product. We use ultra smooth copper foil and ultra low Dk glass fabric that are combined with this novel resin system for optimal performance for the next generation of high-end network and communication systems.”
The three halogen-free circuit materials feature permittivity (Dk) that is stable with temperature from -55 to +125°C and across wide frequency ranges with extremely low loss tangents (Df), enabling designers to produce halogen-free circuits with materials with even less loss than the company’s highly regarded Tachyon® 100G circuit materials (see figure) at 28 GHz.
For example, TerraGreen® 400G exhibits typical Dk of 3.1 at 5, 10, and 20 GHz with typical loss tangent of 0.0018 at the same three evaluation frequencies. TerraGreen® 400GE halogen-free circuit laminates offer higher Dk of 3.4 at 10 and 20 GHz with slightly greater loss, with typical Df of 0.0026 at 10 and 20 GHz. The lowest-loss material of the halogen- free trio, TerraGreen® 400G2, features typical Dk of 3.1 at 5, 10, and 20 GHz with typical Df of 0.0015 at the same three evaluation frequencies.
The halogen-free laminates are available in standard thicknesses of 2 to 18 mil (0.05 to 0.46 mm) with ultra-smooth HVLP and HVLP3 copper foils and choice of 1/3, ½, 1 oz. copper weights (12, 18, and 35 μm). The laminates feature low moisture absorption and support manufacturing processes with multiple lamination cycles while meeting 94 V-0 requirements. The RoHS-compliant circuit materials are ideal for 5G infrastructure, high-speed data centers, and wired and wireless communications equipment. For more information about any of the TerraGreen® 400G, 400GE, or 400G2 circuit materials, please visit the Isola website at www.isola-group.com
PLANO, TX — Siemens Digital Industries Software today announced that Chipletz, an innovative fabless substrate startup, has selected Siemens as its strategic electronic design automation (EDA) provider for the development of its groundbreaking Smart Substrate™ products.
After an extensive technical evaluation of available solutions, Chipletz selected a suite of Siemens’ industry-leading EDA tools for the design and verification of its Smart Substrate technology, which facilitates the heterogeneous integration of multiple ICs in a single package for critical artificial intelligence workloads, immersive consumer experiences, and high-performance computing.
“The Chipletz vision is to revolutionize semiconductor in-package functionality through the development of advanced packaging technology that bridges the gap between the slowing of Moore's Law and the rising demand for compute performance,” said Bryan Black chief executive officer of Chipletz. “Our Smart Substrate designs, now in development, are very demanding. Siemens has demonstrated that they have the ideal technology for our needs.”
To design and verify the heterogeneous integration of multiple ICs into a Smart Substrate based package, Chipletz selected Siemens’ Xpedition™ Substrate Integrator software, Xpedition™ Package Designer software, Hyperlynx™ software and Calibre® 3DSTACK software solutions.
“Siemens is honored to be selected by Chipletz as a primary semiconductor packaging design and verification supplier,” said AJ Incorvaia, senior vice president of Electronic Board Systems at Siemens Digital Industries Software. “The Chipletz Smart Substrate technology offers Chipletz customers a robust path to bring multiple ICs, even from different vendors, into a wide range of system-in-package configurations using Siemens’ design tools to deliver a high-performing and cost-effective end-product.”
PLANO, TX ― Super PCB, a single source for high quality printed circuit boards (PCBs), is pleased to announce the company’s 20th anniversary. Since 2003, Super PCB has been providing the best value in the PCB industry by offering competitive pricing at the highest quality and best-in-class customer support.
“We are so proud to have served this industry for 20 years,” said Jessica Zhang. “In these 20 years, we have established long term relationships with our customers and have witnessed many of them grow and succeed. We feel so blessed to be a part of it! Their success is our success. They rely on our quality and on time delivery. The industry has changed a great deal in the last 20 years. We will continue to keep up with the technology and continue to improve our offerings.”
The team at Super PCB’s mission has been and remains to be the only PCB source that its customers ever need. The company serves the telecom and Wireless, Transportation, Industrial, Medical, Lighting, Consumer Electronics, Energy and IOT industries.
Finding a good PCB source can be a daunting task, especially when you go overseas. The Super PCB team’s expertise helps you find the best match for your PCB needs. Quality control is the toughest task when you outsource your manufacturing. Super PCB finds the best price while keeping the highest quality standard. The company offers high mix-low volume, low mix- high volume and is proud to offer 24-hour turns on request.
The company offers USA manufacturing to support fast-turn and ITAR requirements, as well as overseas manufacturing facilities to support you prototype and mass production to lower costs. Super PCB’s manufacturing facilities are ISO 9001 certified and UL listed. Super PCB’s state-of- art equipment and technology ensures the highest quality and efficiency.
For more information about Super PCB, email This email address is being protected from spambots. You need JavaScript enabled to view it. , call (214) 550-9837 or visit www.superpcb.com
MINNEAPOLIS, MN – The SMTA has announced the accepted speakers for the Wafer-Level Packaging Symposium (WLPS). The symposium will be held February 14-16, 2023 at the Marriott Fremont Silicon Valley in Fremont, California.
Packaging technology expert John Lau, Ph. D., will kick off the program Tuesday afternoon with a Professional Development Course on February 14, 2023. The lecture course is titled, “Advanced Packaging: Fan-out, Chiplet, and Heterogeneous Integration”.
The Technical Program consists of over 20 presentations addressing wafer-level packaging (WLP), 3D packaging, and advanced manufacturing and test technologies. The program will conclude with a “Wafer-Level versus Panel Level” panel discussion moderated by Jan Vardaman. View the full program here.
Registration for WLPS is now available online. Discounted rates are available for conference registration made on or before Wednesday, January 25, 2023. All presentations along with the PDC are included in standard registration this year. Visit https://smta.org/wafer for more information. If there are any questions, please call +1-952-920-7682 or email This email address is being protected from spambots. You need JavaScript enabled to view it..
