SANTA CLARA, CA ― Averatek is pleased to announce that Director of Advanced Process Development Gus Karavakis will present “Thermal Stress Reliability of Stacked Microvias Fabricated with a Liquid Metal Ink Semi-Additive Process” at the IPC APEX Expo Technical Conference, January 24-26, 2023 in the San Diego Convention Center. The technical paper was co-authored by Mike Carano, IPC Technology Roadmap Committee Chair and member of the Board of Directors.
The drive to miniaturization makes the smaller footprint of stacked vias more desirable in terms of routing and design efficiency than staggered vias. However, there is evidence that stacked vias are prone to latent failures after exposure to thermal stress of conventional surface mount technology (SMT) reflow processes. This issue is broadly defined as a weak interface between the plated copper and the blind via target pad. When thermally stressed, the generally weak interface will fracture, especially during forced-convection assembly reflow.
While many studies of microvia interfacial fracture focused on conventional electroless copper as the plated through-hole (PTH) choice, no recent studies measured the reliability of stacked microvias with a semi-additive process (SAP) using a liquid metal ink as the catalytic layer.
This novel catalytic ink promotes a tightly adherent and ultrathin electroless copper deposit. The lower thickness enables much finer line spaces and trace widths than conventional subtractive- etch or modified semi-additive processes (mSAP). Liquid metal ink technology enables capability for 5micron lines and spaces; the tighter line width control will benefit the impedance control.
To measure reliability of the liquid metal ink process, test vehicles were constructed and subjected to Thermal Shock and Thermal Stress testing, according to protocols in IPC-TM-650 Test Method 2.6.27B. Complete results of this study will be covered in the presentation. Test results indicate that the liquid metal ink process provides long-term reliability on two-stack blind vias, while offering distinct functionality advantages beyond conventional subtractive and mSAP processes.
Gus Karavakis has over 30 years of industry experience, with special expertise in advanced processes, additive technologies, IC Packaging and substrates, flex and rigid-flex PCB manufacturing and materials. He is the author/co-author of more than 80 patents, and holds a BE in Chemical Engineering from CCNY with an MS in Chemical Engineering from Columbia University.
WILMINGTON, DE – DuPont Interconnect Solutions (ICS), a business within the Electronics & Industrial segment, will exhibit (Booth #341) at the 2023 edition of the Institute for Printed Circuits (IPC) APEX Exposition to be held in San Diego, CA from January 24 - 26, 2023.
This show is attended by North America’s largest audience engaged in electronics manufacturing. At IPC/APEX, DuPont ICS will engage with PCB fabricators, designers, OEM’s and EMS companies, showcasing its portfolio of innovative, more sustainable metallization, dry film and flexible circuit material solutions for the PCB industry. The ICS portfolio also includes thermal management and electromagnetic shielding solutions from the recently added Laird Performance Materials.
According to Erik Reddington, ICS West Commercial Leader for Metallization & Imaging, and Laminates, IC substrates are expected to be the fastest growing segment of the PCB industry in the coming years. Reddington says the changing technology in printed circuit boards is moving toward smaller vias and finer lines, along with a desire for more sustainable solutions. He says DuPont has continued to innovate and invest in new technologies to address the needs of the PCB industry, becoming the leading total solutions and systems design partner addressing signal integrity and power transmission challenges while taking care of both people and the planet.
Reddington added that DuPont has been the preferred flexible laminate solution provider for more than 40 years. He said DuPont is offering the widest array of PCB construction options which is helping to drive device speed and reliability – enabling a range of applications from 5G connectivity to autonomous vehicles.
DuPont’s recently completed $250 million Kapton® polyimide film manufacturing expansion in Circleville, Ohio is a further illustration of its commitment to expanding printed circuit board manufacturing in the United States and Europe. DuPont has joined the Printed Circuit Board Association of America (PCBAA), the consortium of U.S.- based companies that support U.S. domestic production of printed circuit boards. Reddington said DuPont is using that involvement to better under the needs of the domestic PCB industry and develop solutions to enable next generation material advancements.
During the show, Reddington will address customers and show participants with a presentation on DuPont’s 2023 commitment to the PCS industry. The remarks will be presented on Tuesday, January 24th at 2 PM and Wednesday, January 25th at 3:30 PM at the DuPont booth on the exhibition floor.
CHANDLER, AZ — Rogers Corporation (NYSE: ROG) will be exhibiting in booth #409 at IPC APEX EXPO in San Diego, CA Jan. 24th – 26th , highlighting some of its next generation high performance circuit materials.
Visitors to Rogers’ booth will learn about:
Kappa® 438 Laminates Now Available in 10 Mil
Rogers Kappa 438 laminates were designed using a glass reinforced hydrocarbon ceramic system that offers superior high frequency performance and low-cost circuit fabrication resulting in a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes. Kappa 438 laminates also have the UL 94 V-0 flame retardant rating and are lead free solder process compatible. Standard thicknesses include 10, 20, 30, 40 and 60 mil.
COOLSPAN TECA is a thermosetting, epoxy based, silver filled adhesive film used in bonding high power circuit boards and has a storage life of up to 12 months from date of manufacture. COOLSPAN films provide a convenient and reliable approach to bond high power circuit boards, heavy metal back- planes, heat sink coins and RF module housings. This approach overcomes voiding and flow issues that are problematic for sweat soldering and dispensed adhesive approaches. COOLSPAN TECA films can be tack soldered in a fixture, ensuring accurate registration. This is followed by a tooled thermal cure or PCB press cycle.
Rogers and Fortify to jointly promote 3D Printing Technology:
On January 16, 2023, Rogers Corporation and 3D Fortify Inc. (“Fortify) announced they entered into an expanded agreement to jointly promote Rogers’ 3D printable materials and Fortify’s additive manufacturing equipment. This agreement reinforces the continued commitment to develop electronic applications using the unique capabilities provided by high performance materials such as Rogers’ Radix™ printable RF materials and Fortify’s FLUX Series DLP printers.
PETACH-TIKVA, ISRAEL — Eltek Ltd. (NASDAQ: ELTK), a global manufacturer and supplier of technologically advanced solutions in the field of printed circuit boards, informed today that it received a notification from the Ministry of Environmental Protection about its intention to impose a penalty of approximately $0.6 million for an alleged breach of the Clean Air Law during the years 2019-2020. The Company intends to seek a reduction in the amount of the penalty, in accordance with provisions of the Clean Air Law.
WATERBURY, CT — As one of the world’s largest hi-tech supply chains for the electronics industry, MacDermid Alpha, will showcase its extensive portfolio of integrated circuit, assembly, and semiconductor technologies at IPC APEX EXPO, January 24 – 26, in San Diego, CA. Reaching every aspect of the electronics supply chain from design to post-production, and beyond, MacDermid Alpha will highlight how they support manufacturers across the entire spectrum with solutions that transform ideas into next- generation technologies. Visitors are welcome to discover the latest assembly, circuitry, and semiconductor technologies at booth 1933 and see how they increase efficiency and reliability.
MacDermid Alpha’s technology supply chain is fully optimized with over 3,000 employees worldwide, servicing customers in over 50 countries with local and regional services, a rapid delivery time, lower manufacturing costs, and a seamless ‘start to finish’ experience. Combining strength in critical markets such as 5G, automotive and EV, military, aerospace, medical devices, and consumer goods, with world-class technologies and unrivaled, 24/7 technical support, MacDermid Alpha’s family of brands includes Alpha, Compugraphics, Electrolube, Kester, and MacDermid Enthone.
Julia Murray, Senior Vice President of Marketing at MacDermid Alpha, comments, “We are in a unique position to offer the electronics community a complete ‘start to finish’ technology roadmap with some of the most advanced circuitry, assembly, and semiconductor technologies on the market. We are helping our customers redefine what’s possible and leverage capabilities to the next level. This is something we’re very excited about and we will be showcasing solutions from our 3 cornerstone divisions during the show.”
MacDermid Alpha will also present 4 separate technical papers on lightweight materials, solder alloy performance in automotives following vibration tests, surface finish performance for next- generation technology and assess the performance of assemblies coated with state-of-the-art materials as opposed to standard conformal coatings used by manufacturers. Each technical paper will provide audiences with groundbreaking findings that unlock, explore and unveil new test data.
Visit the MacDermid Alpha team at booth 1933 to find out how to power up complete electronics interconnection solutions. For further information, please visit www.macdermidalpha.com
CHANDLER, AZ — Rogers Corporation (NYSE:ROG) and 3D Fortify Inc. (“Fortify”) entered into an expanded agreement to jointly promote Fortify’s 3D printing equipment and Rogers’ 3D printable materials to further develop the use of additively manufactured parts for electronic and, more specifically, RF/Microwave components.
The agreement enhances Rogers and Fortify’s existing relationship including:
Fortify’s rights to distribute and sell Rogers’ 3D printable materials
Fortify’s rights to qualify Rogers’ materials for use with Fortify equipment
Rogers’ rights to support the sale of Fortify equipment
Rights of both parties to develop and manufacture additive materials for use with Fortify equipment
This agreement reinforces the continued commitment to develop electronic applications using the unique capabilities provided by high performance materials including Rogers’ Radix™ printable RF materials and Fortify’s 3D printing technology, including FLUX Series DLP printers.
Karl Sprentall, Rogers’ Director of New Business Development added, “The scalable manufacturing of high complexity RF components with Radix™ additive manufacturing resins enable our customers to solve new or previously unsolvable problems. It is of critical importance to deliver this technology in a manner that provides the reliability and repeatability that our customers expect from Rogers Corporation products. We have been working closely with Fortify for many years, and their Flux Series DLP printers are ideally suited to produce complex structures with consistent and repeatable dielectric properties. We are excited to expand and strengthen our collaboration with Fortify.”
Joseph Muth, Fortify’s Head of Materials and Process Engineering stated, “Rogers’ materials capability is an ideal match for Fortify’s Flux systems. Together, we are unlocking new application space and streamlining design to device realization. This agreement will allow us to accelerate toward an end-to- end manufacturing platform that enables the future of RF devices.”
