AUSTIN, TX – High Density Packaging (HDP) User Group announces the Jack Fisher Technical Excellence Award to honor the memory of Jack, who passed away on January 20, 2023.
Jack served as an HDP Facilitator for more than 18 years and was a major contributor to the growth of HDP over the course of his tenure. “Jack was a printed circuit board industry icon, which was recognized by his election to the IPC Hall of Fame in 2006. His expertise and experience will be missed by members and staff alike”, said Larry Marcanti, Executive Director of HDP User Group.
The Jack Fisher Technical Excellence Award will be awarded to HDP members who best exemplify the standards set by Jack over the course of his stellar career.
The eulogy given by Larry can be seen here: https://youtu.be/lZGMvZP5FDU
Jack’s obituary: https://www.pressconnects.com/obituaries/bps136484
WALTHAM, MA – Nano Dimension Ltd. (Nasdaq: NNDM, “Nano Dimension” or the “Company”), a leading supplier of Additively Manufactured Electronics (“AME”) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (“AM”) 3D printers, announced today that it has installed one of its 3D printing systems – the Admaflex130 – at NASA’s Marshall Space Flight Center (“Marshall”).
Marshall procured the printing system as part of a project to 3D print sodium ion batteries.
The 3D printing system that is part of Nano Dimension’s multi-product offering comes from the July 2022 acquisition of Admatec Europe B.V. The Admaflex130 is exceptional for its ability to manufacture in multiple materials, specifically ceramics and metals, while also doing so at high precision. With the benefit of its Digital Light Processing (“DLP”) based technology, the 3D printer is ideal for research & development and 24/7 digital serial production of functional parts requiring complex geometries, high resolution, fine details, and smooth surface while benefiting from excellent material properties. The system also offers users the flexibility to develop custom materials and configure all printing parameters.
Yoav Stern, Chairman and Chief Executive Officer of Nano Dimension, shared: “It is hard to imagine working with an organization that is doing more groundbreaking and literally expanding the envelop of space as NASA. We are proud they have selected the Admaflex130 from Nano Dimension. Our team took a risk in developing a system that can print in multiple materials and have open parameter settings, and they did it successfully. We trust this system will enable the pioneering leaders at NASA to fabricate innovative applications. And who knows? Maybe one day soon we’ll see one such application going to Mars.”
SAN JOSE, CA – Cadence Design Systems, Inc., announced today that it is making a $50 million USD purpose-driven investment in an impact investment program managed by RBC Global Asset Management (RBC GAM) to address racial wealth inequities in affordable housing, homeownership and small business.
In partnership with RBC GAM, Cadence will invest in an impact investment strategy that seeks to positively support underserved Black and Latinx individuals and communities nationally, including those in the San Francisco Bay Area, CA; Austin, TX; Columbia, MD; the New York Metropolitan Area; Boston and Burlington, MA; Research Triangle Park in Raleigh, NC; and Pittsburgh, PA—locations where Cadence has significant operations and a community presence. Additionally, a portion of Cadence’s investment will be focused internationally on projects aimed at supporting women and people of color as well as climate justice initiatives.
"Fostering diversity, equity and inclusion is at the core of who we are as a company, and collaborating with RBC GAM to advance racial equity and community development was a very easy choice," said Dr. Anirudh Devgan, president and CEO of Cadence. "We are dedicated to making a difference and look forward to seeing the impact that our partnership will have on Black and Latinx communities across the United States as well as on the international initiatives focused on supporting women, people of color and climate justice."
"Following Black History Month, we’re taking a proactive approach to address the racial income gaps and racial homeownership inequality that exist throughout the United States in commemoration of this important period of reflection," said KT Moore, vice president, Corporate Marketing at Cadence. "At Cadence, we are committed to supporting diversity and revitalizing communities where we operate and are proud to call home."
Cadence’s investment will be allocated in RBC GAM’s Access Capital Community Investing Strategy, which will invest in U.S. government-backed securities to support lending in historically underserved communities.
Access Capital has a quarter century of history of supporting investments in underserved communities and was founded in 1998 by Ron Homer, Chief Strategist of U.S. Impact Investing at RBC Global Asset Management, who is a pioneer of impact investing in the U.S. Mr. Homer, who held executive roles at several Black-owned banks before joining RBC GAM in 2008, has dedicated the entirety of his six-decade career to supporting community development and homeownership in Black communities through impact investing.
"We are excited to work with Cadence on this initiative aimed at reducing racial disparities in income and wealth within the United States," said Mr. Homer. "Through Access Capital’s 25-year history of impact investing, doors have opened that facilitated more people of color to enjoy the benefits of the American dream of wealth, homeownership and income appreciation. On the heels of Black History Month, we must understand the importance of building racial equity across America."
To learn more, please read our blog at www.cadence.com/go/rbcracialequity
CHICAGO – West Chicago PCB fabricator American Standard Circuits has recently purchased and installed two new lines from Circuit Tech International: The etch/strip cupric line for inner layers and the strip/etch/strip ammoniacal line for outer layers after pattern plating.
ASC President and CEO Anaya Vardya commented about the company’s investment in these 2 lines, “We are now commonly dealing with thin core materials down to 1 mil so handling is critical. We are also building boards where we need etching resolution below 0.002” lines and spaces which requires us to have equipment that can handle these parameters and evolve with us for the future. After a thorough evaluation of what was available on the market today, we decided that the Circuit Tech lines were best suited to fit all our needs.”
KANAGAWA, JAPAN – HIROSE Electric Co., Ltd. (Headquarters: Japan), a manufacturer specializing in connectors, and SnapEDA (Headquarters: San Francisco, USA), the internet's first search engine for electronic design, have partnered to release more than 1,000 ready-to use symbols and footprints for a variety of Hirose's PCB mountable connectors.
Required Reduction of Man-hours for Design
During the circuit board design process, engineers must create a digital model for each mounted component. This is a time-consuming task, which hinders a smooth product development cycle.
Contribute to Fast Design and Development
The partnership includes data on over 1,000 symbols and footprints including board-to-board connectors and FPC connectors of Hirose products. This enables designers to easily search for their desired product on SnapEDA and instantly download the data they need, free of charge (SnapEDA membership is required). The digital models are available in over 15 PCB design formats, including Altium, KiCad, Autodesk EAGLE and Fusion 360, OrCAD and Allegro, Proteus, PADS, and more. This collaboration helps streamline and reduce design time, allowing engineers to focus on innovation and development.
Future Development
Hirose Electric aims to expand the data available on SnapEDA. The company remains committed to provide connector solutions and services that help customers design their products more efficiently.
WALTHAM, MA – Nano Dimension Ltd. (Nasdaq: NNDM, “Nano Dimension” or the “Company”), a leading supplier of Additively Manufactured Electronics (“AME”) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (“AM”) 3D printers, announced today that it has received a purchase order from a leading Western intelligence agency, for a DragonFly IV® system, the leading Additive Manufacturing Electronics (AME) 3D-printer.
For reasons of national security, Nano Dimension cannot reveal the name of the country where the intelligence agency is situated, but this is clearly a continuation of the Company’s success in providing leading technology to those who need it most. This intelligence agency, and others like it, which include national armies, navies, air forces, and governmental secret services, rely on the DragonFly IV® to advance innovation in a way that other manufacturing technologies of electronics manufacturing cannot achieve.
The DragonFly IV® system and specialized materials serve cross-industry High-Performance-Electronic-Devices (Hi-PEDs®) fabrication needs by simultaneously depositing proprietary conductive and dielectric substances, while integrating in-situ capacitors, antennas, coils, transformers, and electromechanical components. The outcomes are Hi-PEDs® which are critical enablers of autonomous intelligent drones, cars, satellites, smartphones, and in vivo medical devices. In addition, these products enable iterative development, IP safety, fast time-to-market, and device performance gains.
"I am very excited that another Western Intelligence Agency is investing in the design and production of 3D electronics, to shorten its development cycles and bring to life innovative ideas which could not have been done before,” commented Amit Dror, co-Founder and Chief Customer Success Officer of Nano Dimension.
Mr. Yoav Stern, Chairman and Chief Executive Officer of Nano Dimension, added: “Very importantly, this customer is buying the second machine of the Company, while the first one was Fabrica 2.0 machine. This is a beautiful manifestation of our claims that the synergies of all our acquisitions work together and efficienize our go-to-market performance. 3D printing technologies and materials are irreplaceable, and essential, both for electronics and micro-mechanical parts. Intelligence agencies are leading the forefront of technological innovation applied for high-performance applications, similar to aerospace, advanced medical fields, academy and corporate research departments. We are proud to be chosen as the supplier of such a unique organization. After many years of experience with advanced technologies in the Air Force, I know that leading edge products, which are adopted initially by defense forces, traditionally end up creating very large size commercial markets as well.”