Irvine California, USA – TopLine’s CCGA Column Grid Array IC packages and new Particle Impact Dampers (PID) that reduce random vibration will highlight the company’s exhibit at IPC/APEX EXPO 2018 at the end of this month in San Diego. TopLine will exhibit in Booth 3101, where a PID informational video and demonstration will be held continuously in the booth over the 3-day show.

NESS ZIONA, Israel, February 5, 2018 - Nano Dimension Ltd., a leading additive electronics provider (NASDAQ, TASE: NNDM), has unveiled a new SOLIDWORKS add-in to its DragonFly 2020 Pro 3D Printer that makes additive manufacturing with embedded electronics a feasible option for mechanical and electrical engineers.

BANNOCKBURN, Ill., USA, January 30, 2018 — IPC -- Association Connecting Electronics Industries® announces the addition of Colette Buscemi as senior director of education programs to its staff at IPC headquarters in Bannockburn (Chicago), Ill.

Plainview, NY, USA – Technic Inc. is pleased to announce the appointment of Bruno Kiski as Senior R&D Engineer / Imaging Products.