Press Releases

Career adds a total of 11 Nuvogo™ and Orbotech Diamond 8™ Direct Imaging (DI) solutions to increase flexible PCB production capacity for advanced smartphone manufacturing

Read more: Orbotech Receives Multi-Million Dollar Order from Career Technology for Pattern and Solder Mask...

TOKYO -- THine Electronics, Inc. (JASDAQ: 6769), the global leader in high-speed serial interface and provider of mixed-signal LSI, has been collaborating with several partners in development of transmission lines for THine’s next-generation high-speed interface specification for 4K and 8K video images, V-by-One® US, and Yamaichi Electronics Co., Ltd. *1 will deliver samples of FPC cable that provides potential compliance with V-by-One® US specification.

Read more: THine Announces Yamaichi Electronics' Development of Flexible Printed Circuit (FPC) Cable for...

PORTLAND, Ore., Dec. 04, 2017 (GLOBE NEWSWIRE) -- Electro Scientific Industries, Inc. (Nasdaq:ESIO), an innovator in laser-based manufacturing solutions for the micro-machining industry, today announced that Allen Muhich, former COO and CFO of ID Experts, will join as CFO and Corporate Secretary of the Company and will succeed Paul Oldham on December 5, 2017.

Read more: ESI Selects Allen Muhich To Be Next CFO

December 4, 2017 – Ventec International Group, a world leader in the production of insulated metal substrates, thermally conductive, polyimide & high reliability laminates and prepregs, is proud to support the Skate for the 22 Eagles vs. Boston Bruins Alumni hockey game on December 17th at the Edge Sports Center in Bedford, Massachusetts.

Read more: Ventec Proudly Supports ‘Skate for the 22 Foundation’ to Rise Awareness of Veteran Suicide

INGLESIDE, Illinois, USA (November 30, 2017) – IDENTCO International is pleased to announce that its Monterrey, Mexico operations have been awarded ISO 140001:2015 certification for environmental management systems.

Read more: IDENTCO Mexico Awarded ISO 14001:2015 Certification

Leoben, November 29, 2017 – In addition to its comprehensive portfolio of standard printed circuit board (PCB) technologies, AT&S also has various special processes, materials and technologies that are optimized for specific requirements like high-density wiring, enhanced thermal performance or high frequency (HF).

Read more: Optimized and Cost-efficient Design Implementation Using AT&S X-in-Board Technology

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