September 11, 2017 – Ventec International Group, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, is delighted to announce the appointment of John Pardini in the role of OEM Global Account Manager IMS.

Read more: John Pardini Appointed Global Account Manager for IMS Materials at Ventec

NESS ZIONA, Israel, September 11, 2017 - Nano Dimension Ltd., a leader in the field of 3D printed electronics (NASDAQ, TASE: NNDM), announced today that its wholly owned subsidiary, Nano Dimension Technologies Ltd., intends to collaborate with CADvision, a leading 3D printing distributor in France, to develop the commercial and service infrastructure to commence sales and support of the DragonFly 2020 3D Printer across France, Belgium and Switzerland.

Read more: Nano Dimension Partners with CADvision to Distribute Nano Dimension’s 3D Printer in France,...

New York, New York, September 8, 2017 – BotFactory, Inc., a leader in Additive PCB Fabrication and Assembly technology will be exhibiting their new product at PCB West 2017 at the Santa Clara Convention Center in Santa Clara, California. Called the BotFactory SV2, this desktop-format machine is designed to be the essential tool for engineers, researchers, students and teachers in the Electronics field, allowing them to print and assemble PCBs on rigid or flexible materials directly from their digital PCB layout tools. BotFactory SV2 will be capable of printing 8 mil traces, 2+ layers boards and pick-and-placing of parts as small as 0402 (imperial) with a tape and reel system for 100+ components.

Read more: BotFactory to provide a sneak peek of their new Desktop PCB Printer at PCB West 2017

Waterbury, CT., August 21, 2017 – MacDermid Enthone Electronics Solutions, a MacDermid Performance Solutions business, will present three technical papers at SMTA International Conference, September 17-21 held in Rosemont, IL. SMTA International is a four day technical conference, including workshops as well as a full exhibition. MacDermid Enthone Process Specialists will be presenting papers on recent relevant topics in chemical technologies for electronics manufacturing. All three will present on Tuesday, September 19. Albert Angstenberger will be presenting on copper pillar plating systems and their relationship to thermal management at 11:00 AM. Maria Nikolova will be presenting on an innovative acid copper process for simultaneous filling of vias and plating of through holes at 12:00 PM. Martin Bunce will be presenting on successful ENIG process control under new industry standards at 2:00 PM.

Read more: MacDermid Enthone Electronics Solutions to Present Three Papers at SMTA International Conference