September 28, 2017 – Ventec International Group, a world leader in the production of insulated metal substrates, thermally conductive, polyimide & high reliability laminates and prepregs, will be exhibiting its latest thermally conductive material innovations at the Ford Advanced Lighting Innovation Expo (ALIE) on October 3-4, 2017 in Dearborn, MI.
WATERBURY, Conn, USA, September 21, 2017 – MacDermid Enthone Electronics Solutions, a global electronics chemicals process supplier, will exhibit at the TPCA tradeshow and present two technical papers at the IMPACT 2017 Conference, co-located with TPCA in Taipei, October 25-27, 2017.
Manufacturers are increasingly going to hard-to-find part specialists, indicating a possible coming crunch in the components market.
London, UK — September 2017 — SMART Group, Europe’s largest technical trade association focusing on Surface Mount And Related Technologies, announces that it is co-sponsoring the Process, Design & Reliability Seminar on 9 November with the NPL.
Elected to the Board of Directors, by the members of EOS/ESD Association, Inc., for a two-year term from January 1, 2018 to December 31, 2020, are Brett Carn, Intel Corporation; Charvaka Duvvury, ESD Consulting; Cheryl Checketts, Estatec; and Robert Gauthier, Globalfoundries, Inc. The Board of Directors officers for January 1, 2018 to December 31, 2018 are: Ginger Hansel, Dangelmayer & Associates, President; Alan Righter, Analog Devices, Senior Vice President; and Harald Gossner, Intel., Vice President.
SHANGHAI, Sept. 25, 2017 /PRNewswire/ -- Dr. Hannes Androsch, AT&S Supervisory Board Chairman and member of Chongqing Mayor's International Economic Advisory Council (CMIA), attended the 12th Annual Meeting of the CMIA in Chongqing, China on September 24th.