Press Releases

NESS ZIONA, Israel, January 17, 2018 - Nano Dimension Ltd., the world’s leading additive electronics provider (NASDAQ, TASE: NNDM), today announced that a leading research institute from Hong Kong has purchased the company’s DragonFly 2020 Pro 3D Printer.

Read more: Leading Research Institute in Hong Kong Purchases Nano Dimension DragonFly Pro 2020 3D Printer

WATERBURY, Conn, USA, January 15, 2018 – Specialty chemicals supplier MacDermid Enthone will reveal new electroplating innovations at IPC APEX EXPO 2018, with papers on any-layer via filling, semi-additive processing, and simultaneous via fill with through-hole plating.

Read more: MacDermid Enthone Electronics Solutions to Exhibit and Present Papers at IPC APEX EXPO 2018

Assess PCB assembly fault coverage and find board build errors quicker

APEX THEME 2018 -- SUCCEED AT THE VELOCITY OF TECHNOLOGY

Eindhoven, The Netherlands, January 2018 --The speed of change in the electronics industry is rapidly accelerating. The direction in which the industry moves is constantly shifting...and it needs participation, see you in San Diego!  JTAG Technologies is excited to showcase here in San Diego the latest version of its acclaimed Visualizer graphical viewing tool for board (PCB)  layouts and schematics. Allowing users to assess fault coverage data and pin-point production test faults in a snap.

Read more: JTAG Visualizer Update Adds Features for Faster Debug

“As of January 1st, 2018, the chemist Dr. Pavel Gentschev joined Peters Research GmbH & Co. KG where he fills the position of ”Chief Technology Officer“.

Read more: Chief Technology Officer Completes Peters Management Board

January 11, 2018 – Ventec International Group, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, is pleased to announce that Thomas Michels (Managing Director, Ventec Europe) has been elected to the Board of Directors of the EIPC, effective immediately. Mr. Michel’s appointment expands the Board to 15 members from around Europe who as a group continue to accurately reflect the role of the Institute throughout the value chain of Europe's electronic packaging and interconnection industry.

Read more: Ventec’s Thomas Michels elected to EIPC Board of Directors

Flex and rigid flex circuit board manufacturer, Printed Circuits has started 2018 with a few enhancements to their wet processing department, starting with the appointment of Paul Peters to engineering manager of their plating and wet processing departments.

Read more: Printed Circuits Adds Engineering Manager Paul Peters and New Plating Capability in 2018

Page 267 of 316

Subcategories