Products


Read more: Additive Circuits Adds Missing Conductors Under BGA

The M610x is Stratum 3 compliant and the M611x claims ±0.3 ppm stability from -40°C to +85°C. The company reports low phase noise and 1.5 ppb/g g-sensitivity, with a frequency range of 8 to 52 MHz, availability in 3, 3.3 and 5 V versions in a 5x7mm package, and suitability for a broad range of applications.

www.mtronpti.com


Read more: Technic Releases TechniFlex LCL 1000F

Tyco Electronics has introduced HarnWare design software V5.4, used for the production of drawings and specifications for wire harnesses. The company reports that the drawing package produces a harness assembly drawing, wire list, bill of materials, wiring schematic, weight estimate, and 3 dimensional model.


www.harnware.com

APS announces Meg-A-Pak, for packaging up to 800 grams of two-component reactive adhesives and sealants in flexible pouches. The company reports that Meg-A-Pak provides a combination packaging/mixing burst seal container for a variety of resin systems.

www.adhesivepackaging.com

Acura-BGA exposure unit is for IC substrate manufacturing. Reportedly permits accurate contact between the artwork emulsion and printed circuit board surface, with resolution to 10 µm. Is dedicated to outerlayers with uneven topographic surfaces of 50-100 µm and to exposing soldermask panels with surface irregularities.

Automa-Tech/ORC Imaging, www.automa-tech.com

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