The AVIA 532-38 solid-state laser is said to deliver over 38W
of output at 532 nm (at 120 kHz) with a pulsewidth of 45 nsec. Applications
include singulation of microelectronics packages, wafer scribing, and edge
isolation in solar cells. Based on existing AVIA O/A platform
(oscillator/amplifier cavity) and uses software that reportedly enables
customized pulse control and power on demand.
The 99-490-06 copper alloy EMI shielding and electrical contact gasket is for edge-mount installations for telecom applications. Comes standard in 12" (305 mm) strips with 40 fingers each and a bright finish. Ten additional finish and plating options are available to protect against oxidation.
The gasket mounts to flanges ranging from 0.030" to 0.050" and accepts compression forces in the perpendicular direction by depressing spring arms.
The TE2538W is a double-sided, close proximity exposure system. Uses a roll-to-roll format that reportedly produces a cycle time of 7.2 sec. Is said to occupy the same space as a single-sided machine. Accuracies built into the film transfer and automatic imaging alignment systems are said to produce a repeatable 10 µm line and space at full production speeds and quantities. Has capability of 20 µm pitch and a working area of 260 x 380 mm with a single shot exposure of a 5 kW high-pressure mercury lamp with air cooling. A hard contact mode is included with a cycle time of 15 sec.
Toray Engineering, This email address is being protected from spambots. You need JavaScript enabled to view it.
The Matrix 355 series solid-state lasers are air-cooled systems for OEM integration. The Matrix 355-1-60 is said to deliver more than 1W of average power at a 60 kHz pulse repetition rate; the Matrix 355-2-20 delivers 2W at 20 kHz. Are RoHS compliant. Feature PermAlign component mounting technology, robotic assembly methods, and components such as AAA (Aluminum-free Active Area) pump diodes. Contain UV-compatible materials in the laser head and multi-pass harmonics. Are for stereolithography (rapid prototyping), LCD/FPD titling, memory repair, thin film processing, precision marking and semiconductor scribing.
CADSTAR 10.0 is said to add intelligent functionalities for schematic, library and PCB design, and has an add-on module that provide tighter integration with FPGA design tools. It includes an alternative schematic front-end solution that uses Zuken's E³.logic. This add-on is said to boost users’ productivity. CADSTAR 10.0 also includes extended ODB++ output for manufacturing, the ability to highlight nets using multiple colors, includes FPGA design integration capability and has a fully integrated parts library manager in ‘Design Editor’. CADSTAR 10.0 will be available in December 2007.
PCB123 version 3.0 is a free circuit board design solution. Enhancements include real-time, bi-directional views of layout and schematic; customization via the software development kit; bill of materials generated and updated as the user designs; 3-D design fly-through viewing features and more fabrication options and services.