CN33-802 silver-based conductor paste is designed for feed through-hole applications; CN33-803 is a plateable silver termination conductor for dipping processes; CN34-803 (3:1 palladium/silver) and CN34-820 (20:1 palladium/silver) provide initial and aged adhesion properties; CN37-802 platinum/palladium/silver offers solder leach and silver migration resistance. All conductors are said to be solderable.
Sumitomo resistor pastes are Pb- and cadmium-free. Are for hybrid IC applications. Sumitomo Metal Mining’s RG-A series of Pb- and cadmium-free resistor thick film pastes are reportedly for environmentally friendly chip resistors. Are available in resistances from 0.1 ohm/sq. to 10 Mohm/sq.; are said to exhibit the same electrical characteristics as SMMR-U pastes. Have a fired thickness of 6 to 9 µm and are said to be suitable for hybrid IC, resistor networks, and other applications.
Advanced Design System 2008 is an electronic design automation software platform said to contain productivity breakthroughs for faster communications product design. Includes user interface and technology improvements said to speed the design process. Enhancements reportedly include improved project management, real-time zoom and pan, interactive 3-D layout viewing, stretching, and cut planes; improved LVS (layout vs. schematic) design synchronization; updated design rule checking and artwork export/import; 3-D electromagnetic integration into ADS. Said to contain faster bond wire drawing interface; the latest multi-processor computing, including support for todays 64-bit processors; and high-frequency transient simulations, providing reported average speed improvements of up to 6x for large circuits.
The Inspecta HPL Combo is equipped with software and mechanical features that allow it to perform three different operations simultaneously. By means of multiple reference points within the panel, it reportedly can optimize, position, drill and route without any requirement for moving the panel. Can be used as a drilling machine or router by excluding x-ray source, or as a conventional x-ray machine. Is reportedly possible to locate specific reference points on each pattern/image/circuit.
GreenJet is reportedly the first fully digital solder-mask printing system for PCB production. Is said to replace conventional coating, drying, exposure and development processes with a one-step process. Is said to be adapted to the smaller pad spacing and the tighter registration tolerance requirements. Employs proprietary printing technology.
The film base connector is said to provide a small space interconnection with high-density flexible circuits. Micro bump arrays built on thin film substrates reportedly reduce the thickness of the connection height by more than 70% to 300 µm thick for over 100 pins.
With printable flexible electronics, finer patterns than 30 µm line and space reportedly can be generated with smaller via holes than 80 µm diameters for double sides or multi-layer flexible circuits. The multiple screen printing processes enable embedded passive for all of LCR and active components with thin flexible substrates, including polyimide and polyethylene naphthalate films.
The A5-A probe system automated test platform offers flexible loading and uploading, with a sensitive handling function. Incorporates four high-res CCD cameras for optical scanning. Reportedly automatically separates good and bad boards in a cycle time of less than 15 sec. Handles 100 x 72 mm to 610 x 460 mm board sizes. Minimum thickness is 0.8 mm (320 x 250 mm board size) and 0.6 mm (320 x 250 mm and smaller board size), with a maximum of 4 mm.