Henkel Corporation’s Hysol FF6000, is a reflow curable material that is formulated to provide flux for lead-free solder joint formation delivering claimed protection against mechanical stress when cured.

With the epoxy flux process, bottom side spheres are immersed into Hysol FF6000 prior to component placement. The device is then placed onto the PCB or substrate and travels through reflow. During the reflow process, the flux is said to provide solder joint formation while the epoxy encapsulates each solder sphere. This streamlined approach claims to eliminate the need for dispensing equipment and the time required for underfill application and cure.

The company states that the product can be used for package-on-package (PoP) devices and very large (typically 23 x23 mm or more) BGAs and CSPs, where traditional underfill processes may be problematic.

"Enabling joint formation and sphere encapsulation with one material not only delivers tremendous throughput and cost-saving advantages, it may also provide more robust protection than other underfill alternatives.” says Henkel’s Robert Chu.

www.henkel.com/electronics