FR408HR improved lead-free compatible, low-loss laminate has a thermally and electrically enhanced resin system. The material is designed to meet new designs challenges of high layer counts, heavier copper weights and those that require higher bandwidth. FR408 HR has a Tg of 200ºC, a decomposition temperature of 356ºC. This combination results in a 35% reduction in Z-axis expansion and a 25% improvement in dielectric properties over competitive products in its space.
Showed no degradation in performance after testing under multiple passes at 260ºC assembly after a prolonged exposure to high humidity and temperature on 5.5 mm thick very high layer count boards.