December 2014 cover

 

FEATURES

PCB DESIGN
Using Systems Design Methodology to Manage Complex PCB Designs

Managing the hundreds of interconnections between boards and external connectors and controls, manually, and without error, is virtually impossible. Is there a better way to ensure new configurations communication and design synchronization?
by Rainer Asfalg And Andy Watts

RETROSPECTIVE
In Memoriam

A look back at friends and colleagues who left us in 2014.

 

FIRST PERSON

 

MONEY MATTERS

 

TECH TALK

November 2014 cover

 

FEATURES

FABRICATION
Cost Comparison of Complex PCB Fabrication using Traditional Sequential Lamination Methods versus Interconnect with Conductive Paste

As feature sizes become smaller, the cost of PCB fabrication goes up. Sequential lamination of complex circuit boards, in particular, is a time-consuming and expensive process. This study analyzes costs associated with traditional methods compared with an alternative that uses conductive paste as interconnect between cores.
by Chet A. Palesko, Amy J. Palesko, James Haley And Catherine Shearer

DESIGN TRADEOFFS
Are Tight Tolerances Costing You Money?

Does a tighter tolerance guarantee superior quality and better function, or just a higher unit cost? A look at the tradeoffs.
by Robert Simon

CHEMICAL LABELING
GHS Timeline Update

The latest OSHA hazard communication requirements go into effect next year, impacting manufacturers and all facilities which use chemicals. Are you ready?
by Scott Mazur

 

FIRST PERSON

 

MONEY MATTERS

 

TECH TALK

October 2014 cover

 

FEATURES

COVER STORY
Fresh Faces in the Design Community

The annual PCD&F Salary Survey reveals some sharp contrasts between Western designers and their counterparts in Asia. Plus, is the workforce getting (gasp!) younger?
by Chelsey Drysdale

 

FIRST PERSON

 

MONEY MATTERS

 

TECH TALK

September 2014 cover

 

FEATURES

INSPECTION
Magnification vs. Resolution in Visual Examination Specifications

Widely used standards are inadequate when it comes to specifying visual inspection in terms of magnification, as the manner in which an optical aid is used impacts its magnification. Resolution is a critical parameter that we recommend specifying, along with magnification in requirements for visual inspection.
by Louis Hart and Robert Simmons

 

FIRST PERSON

 

MONEY MATTERS

 

TECH TALK

August 2014 cover

 

FEATURES

PI SIMULATION
Power Integrity Analysis Using Free Software
While commercial software is more substantial, and freeware requires more clever ways to set up the simulation and interpret the results, the author finds the available tools surprisingly effective.
by Istvan Nagy

COVER STORY
A Two-Team Race?
Apple and Samsung are the top customers of nine of the 20 largest PCB fabricators, and as the annual NTI-100 list demonstrates, those makers did well in 2013. Is their success sustainable?
by Dr. Hayao Nakahara

BOARD RELIABILITY
Nonfunctional Pads: Should They Stay or Should They Go?
To understand the influence of NFPs on reliability, industry experts were surveyed. Will their response settle the debate?
by Greg Caswell and Cheryl Tulkoff

DATA TRANSFER
Latest IPC-2581 Revision Gaining Widespread Appeal
Enhancements to the stackup and assembly data have the supply chain signing on to the electronics data transfer format.
by Mike Buetow

 

FIRST PERSON

 

MONEY MATTERS

 

TECH TALK

 

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