New Products

No. 813 is a gas-heated 500°F(~260°C) walk-in oven, currently used for curing printed circuit boards.

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LabVIEW 2018 software is for test workflows. Includes new tools that reportedly simplify system integration and grant more control through hardware accessibility.

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Ansys 19.1 delivers new analysis capabilities in the electromagnetics suite for designing wireless communication, autonomous and electrification technologies.

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Stanna-COF immersion tin enables chip-on-film (CoF) technology.

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Cupracid Flex and InPro Flex are designed for standard conformal flex applications.

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tec-speed 20.0 high-frequency laminate and prepreg series is a ceramic-filled hydrocarbon thermoset material for such printed circuit board applications as cellular base station antennas, power amplifiers, LNB for broadcast satellites, automotive radar and RFID.

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