New Products

KiCad schematic capture and printed circuit board online tool now includes a beta release of a library consisting of nearly 1,000 common parts for open source use.

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HyperLynx printed circuit board simulation software now performs end-to-end, fully automated serializer/deserializer (SerDes) channel validation.

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AC-7303 copper-clad laminate offers thermal conductivity of 3W/mK, a reported modulus 1/10 that of conventional materials, and flexible dielectric layer (after curing).

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FAB 3000 v. 7 is CAM software runs advanced DRC/DfM verifications, generates component centroids, creates SMT stencil pads, panelizes PCBs, and performs other useful features.

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RO4460G2 low-loss bondply has a 6.15 dielectric constant (Dk).

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SiP-id software is said to reduce design iterations and improve throughput, reducing time needed to design and verify ultra-complex SiP packages.

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